Wonderful PCB (HK) limited
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Wonderful PCB (HK) limited
Split Flexible PCB with 0.3 to 14oz Copper Thickness, UL-, SGS- and RoHS-approved, FPC LED
  • Split Flexible PCB with 0.3 to 14oz Copper Thickness, UL-, SGS- and RoHS-approved, FPC LED
Split Flexible PCB with 0.3 to 14oz Copper Thickness, UL-, SGS- and RoHS-approved, FPC LED

Split Flexible PCB with 0.3 to 14oz Copper Thickness, UL-, SGS- and RoHS-approved, FPC LED

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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • FPC board with 0.3 to 14oz copper thickness, UL-, SGS- andRoHS-approved
  • Key specifications:
    • Used for LCD, mobile phones and other military/civilproducts
    • Materials: FR4 with Hi-TG
    • Surface finished: HAL
    • Copper thickness: 0.3 to 14oz
    • Layer: 1 to 6 layers
    • Application: digital electronic materials, power, and securityproducts
  • Capability:
    • Layer: 1 to 28
    • Board finished thickness: 0.21 to 7.0mm
    • Material: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free androgers available
    • Max. finished board size: 580 x 900mm
    • Min. drilled hole size: 3mil (0.075mm)
    • Min. line width: 3mil (0.075mm)
    • Min. line spacing: 3mil (0.075mm)
    • Surface finish/treatment: HASL/HASL lead free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP and goldplating
    • Solder mask color: green/yellow/black/white/red/blue
    • Copper thickness in hole: >25.0μm (>1mil)
    • Inner packing: vacuum packing/plastic bag
    • Outer packing: standard carton packing
    • Shape tolerance: ±0.13mm
    • Hole tolerance:
    • PTH: ±0.076mm
    • NPTH: ±0.05mm
  • UL pending
  • Special requirements: buried and blind vias, controlledimpedance and BGA
  • Profiling: punching, routing, V-cut and beveling
  • Used for LCD, mobile phones and other military/civilproducts
  • Materials: FR4 with Hi-TG
  • Surface finished: HAL
  • Copper thickness: 0.3 to 14oz
  • Layer: 1 to 6 layers
  • Application: digital electronic materials, power, and securityproducts
  • Layer: 1 to 28
  • Board finished thickness: 0.21 to 7.0mm
  • Material: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free androgers available
  • Max. finished board size: 580 x 900mm
  • Min. drilled hole size: 3mil (0.075mm)
  • Min. line width: 3mil (0.075mm)
  • Min. line spacing: 3mil (0.075mm)
  • Surface finish/treatment: HASL/HASL lead free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP and goldplating
  • Solder mask color: green/yellow/black/white/red/blue
  • Copper thickness in hole: >25.0μm (>1mil)
  • Inner packing: vacuum packing/plastic bag
  • Outer packing: standard carton packing
  • Shape tolerance: ±0.13mm
  • Hole tolerance:
  • PTH: ±0.076mm
  • NPTH: ±0.05mm

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