
Split Flexible PCB with Board Thickness of 3.0mm, OSP Surface Technique
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Product Description
Product Description
- Layer: 1 to 28
- Board finished thickness: 0.21 to 7.0mm
- Material: FR-4, CEM-1, CEM-3, High TG, FR4 halogen free androgers available
- Max. finished board size: 580mm x 900mm
- Min. drilled hole size: 3mil (0.075mm)
- Min. line width: 3mil (0.075mm)
- Min. line spacing: 3mil (0.075mm)
- Surface finish/treatment: HASL/HASL lead free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP and goldplating
- Copper thickness: 0.5 to 7.0oz
- Solder mask color: green/yellow/black/white/red/blue
- Copper thickness in hole: >25.0μm (>1mil)
- Inner packing: vacuum packing/plastic bag
- Outer packing: standard carton packing
- Shape tolerance: ±0.13mm
- Hole tolerance:
- PTH: ±0.076mm
- NPTH: ±0.05mm
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