PCB with 2.0mm Thickness, 1oz Copper and Plating Gold Immersion for Electronics

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Reference our production capability for rigid PCB:

Layer: 1 to 28
Board finished thickness: 0.21 to 7.0mm
Material: FR-4, CEM-1,CEM-3, high TG, FR4 halogen free,rogers
Finished board size: 23 × 25 (580 x 900mm) (maximum)
Drilled hole size: 3-mil (0.075mm) (maximum)
Line width: 3 mils (0.075mm) (maximum)
Line spacing: 3 mils (0.075mm) (maximum)
Surface finish/treatment: HASL/HASL lead free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP, gold plating
Copper thickness: 0.5 to 7.0Oz
Solder mask color: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0um (>1 mil)
Inner packing: vacuum packing/plastic bag
Outer packing: standard carton packing
Shape tolerance: ±0.13
Hole tolerance:
- PTH: ±0.076
- NPTH: ±0.05
Certificate: UL
Requirements: buried and blind vias + controlled impedance +BGA
Profiling: punching, routing, V-Cut, beveling
Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products

Disclaimer: All trademarks shown here are for referencepurposes only. They are the property of their respective owners,and we are not authorized to sell items bearing suchtrademarks.

Layer: 1 to 28

Board finished thickness: 0.21 to 7.0mm

Material: FR-4, CEM-1,CEM-3, high TG, FR4 halogen free,rogers

Finished board size: 23 × 25 (580 x 900mm) (maximum)

Drilled hole size: 3-mil (0.075mm) (maximum)

Line width: 3 mils (0.075mm) (maximum)

Line spacing: 3 mils (0.075mm) (maximum)

Surface finish/treatment: HASL/HASL lead free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP, gold plating

Copper thickness: 0.5 to 7.0Oz

Solder mask color: green/yellow/black/white/red/blue

Copper thickness in hole: >25.0um (>1 mil)

Inner packing: vacuum packing/plastic bag