Multilayer PCB with Blind and Buried Vias, 0.2 to 7.0mm Thickness, Used to Motherboard

Get Latest Price

Payment Type:: Telegraphic Transfer in Advance (Advance TT, T/T)

Quantity:

Your message must be between 20 to 2000 characters

Contact Now

Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Reference: our production capability for rigid PCB

Layers: 1 to 28

Board finished thickness: 0.2 to 7.0mm

Material: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free androgers

Finished board size: 23 x 25 (580 x 900mm) (maximum)

Drilled hole size: 3 mil (0.075mm) (minimum)

Line width: 3 mil (0.075mm) (minimum)

Line spacing: 3 mil (0.075mm) (minimum)

Copper thickness: 0.5 to 7.0oz

Solder mask color: green/yellow/black/white/red/blue

Copper thickness in hole: >25.0μm (>1 mil)

Inner packing: vacuum packing/plastic bag

Outer packing: standard carton packing

Shape tolerance: ±0.13

Hole tolerance:

PTH: ±0.076
NPTH: ±0.05

Certificates: UL and SGS

RoHS directive-compliant

Special requirements: buried and blind visa + controlledimpedance + BGA

Profiling: punching, routing, V-cut and beveling

Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products

All trademarks shown here are for reference purposesonly. They are the property of their respective owners, and we arenot authorized to sell items bearing such trademarks.

PTH: ±0.076

NPTH: ±0.05

Send your message to this supplier

* From:
* To:

Ms. Shengwen
* Messages:

Enter between 20 to 4,000 characters.

Related Keywords