Wonderful PCB (HK) limited
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Wonderful PCB (HK) limited
Multilayer PCB with 0.5 to 7.0oz Copper Thickness, Green Solder Mask and ENIG Surface Finish
  • Multilayer PCB with 0.5 to 7.0oz Copper Thickness, Green Solder Mask and ENIG Surface Finish
Multilayer PCB with 0.5 to 7.0oz Copper Thickness, Green Solder Mask and ENIG Surface Finish

Multilayer PCB with 0.5 to 7.0oz Copper Thickness, Green Solder Mask and ENIG Surface Finish

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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Double PCB for remote controls with 2oz copper thickness
  • Key specifications:
    • Material: FR-4
    • Layer: 4
    • Copper thickness: 1oz
    • Solder mask: green
    • Silkscreen: white
    • Surface finish: ENIG
    • Buried and blind hole: no
  • Application: gas detector, remote control, telecommunicationproducts
  • Our production capability for rigid PCB:
    • Layers: 1 to 28
    • Board finished thickness: 0.2 to 7.0mm
    • Material: FR-4, CEM-1, CEM-3, high-TG, FR4 halogen-free andRogers
    • Maximum finished board size: 23 × 25 inches (580 ×900mm)
    • Minimum drilled hole size: 3mil (0.075mm)
    • Minimum line width: 3mil (0.075mm)
    • Minimum line spacing: 3mil (0.075mm)
    • Surface finish/treatment: HASL/HASL lead-free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP and goldplating
    • Copper thickness: 0.5 to 7.0oz
    • Solder mask color: green/yellow/black/white/red/blue
    • Copper thickness in hole: >25.0µm (>1mil)
    • Inner packing: vacuum packing/plastic bag
    • Outer packing: standard carton packing
    • Shape tolerance: ±0.13
    • Hole tolerance:
      • PTH: ±0.076
      • NPTH: ±0.05
    • Certificate: UL, SGS and RoHS
    • Special requirements: buried and blind via + controlledimpedance + BGA
    • Profiling: punching, routing, V-cut, beveling
    • Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products
  • All trademarks shown here are for reference purposesonly. They are the property of their respective owners, and we arenot authorized to sell items bearing such trademarks.
  • Material: FR-4
  • Layer: 4
  • Copper thickness: 1oz
  • Solder mask: green
  • Silkscreen: white
  • Surface finish: ENIG
  • Buried and blind hole: no
  • Layers: 1 to 28
  • Board finished thickness: 0.2 to 7.0mm
  • Material: FR-4, CEM-1, CEM-3, high-TG, FR4 halogen-free andRogers
  • Maximum finished board size: 23 × 25 inches (580 ×900mm)
  • Minimum drilled hole size: 3mil (0.075mm)
  • Minimum line width: 3mil (0.075mm)
  • Minimum line spacing: 3mil (0.075mm)
  • Surface finish/treatment: HASL/HASL lead-free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP and goldplating
  • Copper thickness: 0.5 to 7.0oz
  • Solder mask color: green/yellow/black/white/red/blue
  • Copper thickness in hole: >25.0µm (>1mil)
  • Inner packing: vacuum packing/plastic bag
  • Outer packing: standard carton packing
  • Shape tolerance: ±0.13
  • Hole tolerance:
    • PTH: ±0.076
    • NPTH: ±0.05
  • Certificate: UL, SGS and RoHS
  • Special requirements: buried and blind via + controlledimpedance + BGA
  • Profiling: punching, routing, V-cut, beveling
  • Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products
  • PTH: ±0.076
  • NPTH: ±0.05

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