PCB Assembly for Power Supply with 0.21 to 7.0mm Board Thickness

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Basic Info

Payment Type:	Telegraphic Transfer (TT,T/T)

Product Description

Specifications:

Materials: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free androgers
Thick gold plating PCB with overall thickness: 1.6 to3.2mm
Layers: 1 to 28
Board finished thickness: 0.21 to 7.0mm
Maximum finished board size: 23 x 25mm (580 x 900mm)
Minimum drilled hole size: 3 mils (0.075mm)
Minimum line width: 3 mils (0.075mm)
Minimum line spacing: 3 mils (0.075mm)
Surface finish/treatment: HASL/HASL lead-free, HAL, chemicaltin, chemical gold, immersion silver, gold, OSP and goldplating
Copper thickness: 0.5 to 7.0oz
Solder mask color: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0μm (>1 mil)
Shape tolerance: ±0.13
Hole tolerance:
- PTH: ±0.076
- NPTH: ±0.05
Profiling: punching, routing, V-cut and beveling
Packing:
- Inner: vacuum packing/plastic bag
- Outer: standard carton packing

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Materials: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free androgers

Thick gold plating PCB with overall thickness: 1.6 to3.2mm

Layers: 1 to 28

Board finished thickness: 0.21 to 7.0mm

Maximum finished board size: 23 x 25mm (580 x 900mm)

Minimum drilled hole size: 3 mils (0.075mm)

Minimum line width: 3 mils (0.075mm)

Minimum line spacing: 3 mils (0.075mm)

Surface finish/treatment: HASL/HASL lead-free, HAL, chemicaltin, chemical gold, immersion silver, gold, OSP and goldplating

Copper thickness: 0.5 to 7.0oz

Solder mask color: green/yellow/black/white/red/blue

Copper thickness in hole: >25.0μm (>1 mil)