PCB Assembly, Different Materials Available, 1oz Copper Thickness, 1.6mm Finishing Thickness

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Our fabrication capacity for rigid PCB:

Layer counts: 1 to 28
Board finishing thickness: 0.21 to 7.0mm
Material: FR-4, CEM-1, CEM-3, high-TG, FR4 halogen free andRogers
Maximum finishing board size: 23 x 25 (58mm)
Size: 150 x 175mm
Minimum drilled hole size: 3-mil (0.075mm)
Minimum line width: 3-mil (0.075mm)
Minimum line spacing: 3-mil (0.075mm)
Surface finishing/treatment: HASL/HASL lead free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP, gold-plating
Copper thickness: 0.5 to 7.0oz
Solder mask color: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0um (>1mil)
Inner packing: vacuum packing/plastic bag
Outer packing: standard carton packing
Shape tolerance: ±.13
Hole tolerance:
- PTH: ±.076
- NPTH: ±.05
Special requirements: buried and blind via + controlledimpedance + BGA
Profiling: punching, routing, V-CUT, beveling
Provides OEM services to all sorts of printed

All trademarks shown here are for reference purposesonly. They are the property of their respective owners, and we arenot authorized to sell items bearing such trademarks.

Layer counts: 1 to 28

Board finishing thickness: 0.21 to 7.0mm

Material: FR-4, CEM-1, CEM-3, high-TG, FR4 halogen free andRogers

Maximum finishing board size: 23 x 25 (58mm)

Size: 150 x 175mm

Minimum drilled hole size: 3-mil (0.075mm)

Minimum line width: 3-mil (0.075mm)

Minimum line spacing: 3-mil (0.075mm)

Surface finishing/treatment: HASL/HASL lead free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP, gold-plating

Copper thickness: 0.5 to 7.0oz

Solder mask color: green/yellow/black/white/red/blue

Copper thickness in hole: >25.0um (>1mil)