Multilayer PCB with 1oz Copper Thickness and ENIG Surface Finish

Multilayer PCB with 1oz Copper Thickness and ENIG Surface Finish

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Key specifications:

Material: FR-4
Layers: 4
Copper thickness: 1oz
Solder mask: green
Silkscreen: white
Surface finish: ENIG
Buried and blind hole: no

Applications: gas detectors, remote controls, andtelecommunication products

Our production capability for rigid PCB:

Layers: 1 to 28

Board finished thickness: 0.2 to 7.0mm

Materials: FR-4, CEM-1, CEM-3, high TG, FR4 halogen-free, androgers

Maximum finished board size: 23 x 25 inches (580 x 900mm)

Minimum drilled hole size: 3 mils (0.075mm)

Minimum line width: 3 mils (0.075mm)

Minimum line spacing: 3 mils (0.075mm)

Material: FR-4

Layers: 4

Copper thickness: 1oz

Solder mask: green

Silkscreen: white

Surface finish: ENIG

Buried and blind hole: no

Surface finish/treatment:

HASL/HASL lead-free, HAL, chemical tin, and chemical gold

Immersion silver/gold, OSP, and gold plating

Copper thickness: 0.5 to 7.0oz

Solder mask colors: green, yellow, black, white, red, andblue

Copper thickness in hole: >25.0µm (>1mil)

Inner packing: vacuum packing per plastic bag

Outer packing: standard carton packing

Shape tolerance: ±0.13

Hole tolerance:

PTH: ±0.076

NPTH: ±0.05

Special requirements: buried and blind visa, controlledimpedance, and BGA

Profiling: punching, routing, V-cut, and beveling

Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products

Disclaimer: All trademarks shown here are for referencepurposes only. They are the property of their respective owners,and we are not authorized to sell items bearing suchtrademarks.

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