Wonderful PCB (HK) limited
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Wonderful PCB (HK) limited
Double PCB for Remote Controls with 2oz Copper Thickness, Circuit Board, Multilayer PCB Design
  • Double PCB for Remote Controls with 2oz Copper Thickness, Circuit Board, Multilayer PCB Design
Double PCB for Remote Controls with 2oz Copper Thickness, Circuit Board, Multilayer PCB Design

Double PCB for Remote Controls with 2oz Copper Thickness, Circuit Board, Multilayer PCB Design

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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Specifications:
    • Material: FR-4
    • Layers: 2
    • Copper thickness: 2oz
    • Solder mask: green
    • Silkscreen: white
    • Surface finish: ENIG
    • Buried and blind hole: no
  • Application: gas detector, remote control, telecommunicationproducts
  • Production capability for rigid PCB:
    • Layers: 1 to 28
    • Board finished thickness: 0.2 to 7.0mm
    • Material: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free androgers
    • Maximum finished board size: 23 x 25 (580 x 900mm)
    • Minimum drilled hole size: 3-mil (0.075mm)
    • Minimum line width: 3-mil (0.075mm)
    • Minimum line spacing: 3-mil (0.075mm)
    • Surface finish/treatment : HASL/HASL lead free, HAL, chemicaltin and chemical gold
    • Immersion silver/gold, OSP, gold plating
    • Copper thickness: 0.5 to 7.0oz
    • Solder mask color: green/yellow/black/white/red/blue
    • Copper thickness in hole: >25.0µm (>1-mil)
    • Inner packing: vacuum packing/plastic bag
    • Outer packing: standard carton packing
    • Shape tolerance: ±0.13
    • Hole tolerance:
      • PTH: ±0.076
      • NPTH: ±0.05
    • Special requirements: buried and blind vias + controlledimpedance + BGA
    • Profiling: punching, routing, V-cut, beveling
    • Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products
  • Disclaimer: All trademarks shown here are for referencepurposes only. They are the property of their respective owners,and we are not authorized to sell items bearing suchtrademarks.
  • Material: FR-4
  • Layers: 2
  • Copper thickness: 2oz
  • Solder mask: green
  • Silkscreen: white
  • Surface finish: ENIG
  • Buried and blind hole: no
  • Layers: 1 to 28
  • Board finished thickness: 0.2 to 7.0mm
  • Material: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free androgers
  • Maximum finished board size: 23 x 25 (580 x 900mm)
  • Minimum drilled hole size: 3-mil (0.075mm)
  • Minimum line width: 3-mil (0.075mm)
  • Minimum line spacing: 3-mil (0.075mm)
  • Surface finish/treatment : HASL/HASL lead free, HAL, chemicaltin and chemical gold
  • Immersion silver/gold, OSP, gold plating
  • Copper thickness: 0.5 to 7.0oz
  • Solder mask color: green/yellow/black/white/red/blue
  • Copper thickness in hole: >25.0µm (>1-mil)
  • Inner packing: vacuum packing/plastic bag
  • Outer packing: standard carton packing
  • Shape tolerance: ±0.13
  • Hole tolerance:
    • PTH: ±0.076
    • NPTH: ±0.05
  • Special requirements: buried and blind vias + controlledimpedance + BGA
  • Profiling: punching, routing, V-cut, beveling
  • Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products
  • PTH: ±0.076
  • NPTH: ±0.05

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