Multilayer/Double Sides/Multilayer Circuit Board/PCB Design, Electronic Board and Plex FPC

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Basic Info

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Product Description

Immersion gold 6 layers of printed circuit board

Material: FR-4 2mm 2/2Ooz

Minimum line width/space: 0.2/0.17mm

Reference:

Our production capability for rigid PCB:
- Layers: 1 to 28
- Board finished thickness: 0.21 to 7.0mm
- Materials: FR-4, CEM-1,CEM-3, High TG, FR4 Halogen free andRogers
- Maximum finished board size: 23 x 25 (580 x 900mm)
- Minimum drilled hole size: 3 mils (0.075mm)
- Minimum line width: 3 mils (0.075mm)
- Minimum line spacing: 3 mils (0.075mm)
- Surface finish/treatment: HASL/HASL lead free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP, gold plating
- Copper thickness: 0.5 to 7.0oz
- Solder mask color: green/yellow/black/white/red/blue
- Copper thickness in hole: >25.0μm (>1mil)
- Inner packing: vacuum packing/plastic bag
- Outer packing: standard carton packing
- Shape tolerance: ±0.13
- Hole tolerance:
  - PTH: ±0.076
  - NPTH: ±0.05
- Certificate: UL
- Special requirements: buried and blind via + controlledimpedance + BGA
- Profiling: punching, routing, V-CUT, beveling

Disclaimer: All trademarks shown here are for referencepurposes only. They are the property of their respective owners,and we are not authorized to sell items bearing suchtrademarks.

Our production capability for rigid PCB:

Layers: 1 to 28
Board finished thickness: 0.21 to 7.0mm
Materials: FR-4, CEM-1,CEM-3, High TG, FR4 Halogen free andRogers
Maximum finished board size: 23 x 25 (580 x 900mm)
Minimum drilled hole size: 3 mils (0.075mm)
Minimum line width: 3 mils (0.075mm)
Minimum line spacing: 3 mils (0.075mm)
Surface finish/treatment: HASL/HASL lead free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP, gold plating
Copper thickness: 0.5 to 7.0oz
Solder mask color: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0μm (>1mil)
Inner packing: vacuum packing/plastic bag
Outer packing: standard carton packing
Shape tolerance: ±0.13
Hole tolerance:
- PTH: ±0.076
- NPTH: ±0.05
Certificate: UL
Special requirements: buried and blind via + controlledimpedance + BGA
Profiling: punching, routing, V-CUT, beveling