Multi-layered PCB with FR4 Material, Sized 142.24 x 82.55mm, 1/1oz Copper, Used for Mobile Phones

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Specifications:

Size: 142.24 x 82.55mm
Layers: 1 to 28
Board finished thickness: 0.21 to 7.0mm
Materials: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free,Rogers
Maximum finished board size: 23 × 25cm (580 x 900mm)
Minimum drilled hole size: 3 mils (0.075mm)
Minimum line width: 3 mils (0.075mm)
Minimum line spacing: 3 mils (0.075mm)
Surface finish/treatment: HASL/HASL lead free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP, gold plating
Copper thickness: 0.5 to 7.0oz
Solder mask color: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0um (>1 mil)
Inner packing: vacuum packing/plastic bag
Outer packing: standard carton packing
Shape tolerance: ±0.13
Hole tolerance:
- PTH: ±0.076
- NPTH: ±0.05
Certificate: UL
Special requirements: buried and blind via + controlledimpedance + BGA
Profiling: punching, routing, V-cut, beveling

Disclaimer: All trademarks shown here are for referencepurposes only. They are the property of their respective owners,and we are not authorized to sell items bearing suchtrademarks.

Size: 142.24 x 82.55mm

Layers: 1 to 28

Board finished thickness: 0.21 to 7.0mm

Materials: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free,Rogers

Maximum finished board size: 23 × 25cm (580 x 900mm)

Minimum drilled hole size: 3 mils (0.075mm)

Minimum line width: 3 mils (0.075mm)

Minimum line spacing: 3 mils (0.075mm)

Surface finish/treatment: HASL/HASL lead free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP, gold plating

Copper thickness: 0.5 to 7.0oz

Solder mask color: green/yellow/black/white/red/blue

Copper thickness in hole: >25.0um (>1 mil)