
Multilayer PCB with Chemical Gold, Immersion Silver, Gold Plating Surface Finish
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Product Description
Product Description
- Inner: 3oz
- Outer: 3.5oz
- Layers: 1 to 28
- Board finished thickness: 0.21 to 7.0mm
- Materials: FR-4, CEM-1, CEM-3, high TG, FR4 Halogen free,Rogers
- Maximum finished board size: 23 x 25 (580 x 900mm)
- Minimum drilled hole size: 3 mils (0.075mm)
- Minimum line width: 3 mils (0.075mm)
- Minimum line spacing: 3 mils (0.075mm)
- Surface finish/treatment: HASL/HASL lead free, Hal, chemicaltin, chemical gold, immersion silver/gold, OSP, gold plating
- Copper thickness: 0.5 to 7.0oz
- Solder mask colors: green/yellow/black/white/red/blue
- Copper thickness in hole: >25.0um (>1 mil)
- Inner packing: vacuum packing/plastic bag
- Outer packing: standard carton packing
- Shape tolerance: ±0.13
- Hole tolerance:
- PTH: ±0.076
- NPTH: ±0.05
- Certificates: UL, ISO: 9001, ISO: 14001
- Special requirements: buried and blind Via-sat + controlledimpedance + BGA
- Profiling: punching, routing, V-cut, beveling
- PTH: ±0.076
- NPTH: ±0.05
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