
6-layer Mobile Phone PCB Board, ENIG, Black Solder Mask Color, Buried & Blind Holes, OSP and BGA
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Basic Info
Payment Type: | L/C, D/A, D/P, T/T, Western Union, MoneyGram or Pa |
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Product Description
Product Description
- Board size: 210.76 x 86.1
- Base material: FR-4
- Layer: 6-layer
- Copper thickness: 1oz
- Board thickness: 1.0mm
- Solder mask color: Black
- Legend color: White
- Hole type: Buried & blind holes
- Surface fining: ENIG, OSP
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