
Immersion Gold Double-sided PCB for Wireless Phone with >6H Solder Mask Abrasion, Multilayer PCB
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Basic Info
Payment Type: | Telegraphic Transfer in Advance (Advance TT, T/T) |
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Product Description
Product Description
- Layer counts: 1 to 28
- Board finished thickness: 0.21 to 7.0mm
- Material: FR-4, CEM-1, CEM-3, High TG, FR4 halogen free,rogers
- Finished board size: 23 x 25 (580mm) (maximum)
- Drilled hole size: 3mil (0.075mm) (minimum)
- Line width: 3mil (0.075mm) (minimum)
- Line spacing: 3mil (0.075mm) (minimum)
- Surface finish/treatment: HASL/HASL lead free, HAL, chemicaltin, chemical gold
- Immersion silver/gold, OSP, gold plating
- Copper thickness: 0.5 to 7.0 OZ
- Solder mask color: green/yellow/black/white/red/blue
- Copper thickness in hole: >25.0um (>1mil)
- Inner packing: vacuum packing/plastic bag
- Outer packing: standard carton packing
- Shape tolerance: ±.13
- Hole tolerance: PTH: ±.076 NPTH: ±.05
- Special requirements: buried and blind vias + controlledimpedance +BGA
- Profiling: punching, routing, V-CUT, beveling
- Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products
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