Wonderful PCB (HK) limited
Wonderful PCB (HK) limited
Immersion Gold Double-sided PCB for Wireless Phone with >6H Solder Mask Abrasion, Multilayer PCB
  • Immersion Gold Double-sided PCB for Wireless Phone with >6H Solder Mask Abrasion, Multilayer PCB
Immersion Gold Double-sided PCB for Wireless Phone with >6H Solder Mask Abrasion, Multilayer PCB

Immersion Gold Double-sided PCB for Wireless Phone with >6H Solder Mask Abrasion, Multilayer PCB

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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Immersion gold finished
  • PTH hole diameter tolerance: 3mil
  • NPTH hole diameter tolerance: 2mil
  • Hole position deviation: 2mil
  • Outline tolerance: 4mil
  • S/M pitch: 4mil (minimum)
  • Solder mask abrasion: >6H
  • Twist and bent: ≤1.0%
  • Peel off strength: 1.4N/mm
  • E-test voltage: 50 to 300V
  • Flammability: 94V-O
  • Excellent PCB board manufacturer in China
  • Our fabrication capacity for PCB:
    • Layer counts: 1 to 28
    • Board finished thickness: 0.21 to 7.0mm
    • Material: FR-4, CEM-1, CEM-3, High TG, FR4 halogen free,rogers
    • Finished board size: 23 x 25 (580mm) (maximum)
    • Drilled hole size: 3mil (0.075mm) (minimum)
    • Line width: 3mil (0.075mm) (minimum)
    • Line spacing: 3mil (0.075mm) (minimum)
    • Surface finish/treatment: HASL/HASL lead free, HAL, chemicaltin, chemical gold
    • Immersion silver/gold, OSP, gold plating
    • Copper thickness: 0.5 to 7.0 OZ
    • Solder mask color: green/yellow/black/white/red/blue
    • Copper thickness in hole: >25.0um (>1mil)
    • Inner packing: vacuum packing/plastic bag
    • Outer packing: standard carton packing
    • Shape tolerance: ±.13
    • Hole tolerance: PTH: ±.076 NPTH: ±.05
    • Special requirements: buried and blind vias + controlledimpedance +BGA
    • Profiling: punching, routing, V-CUT, beveling
    • Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products
  • Layer counts: 1 to 28
  • Board finished thickness: 0.21 to 7.0mm
  • Material: FR-4, CEM-1, CEM-3, High TG, FR4 halogen free,rogers
  • Finished board size: 23 x 25 (580mm) (maximum)
  • Drilled hole size: 3mil (0.075mm) (minimum)
  • Line width: 3mil (0.075mm) (minimum)
  • Line spacing: 3mil (0.075mm) (minimum)
  • Surface finish/treatment: HASL/HASL lead free, HAL, chemicaltin, chemical gold
  • Immersion silver/gold, OSP, gold plating
  • Copper thickness: 0.5 to 7.0 OZ
  • Solder mask color: green/yellow/black/white/red/blue
  • Copper thickness in hole: >25.0um (>1mil)
  • Inner packing: vacuum packing/plastic bag
  • Outer packing: standard carton packing
  • Shape tolerance: ±.13
  • Hole tolerance: PTH: ±.076 NPTH: ±.05
  • Special requirements: buried and blind vias + controlledimpedance +BGA
  • Profiling: punching, routing, V-CUT, beveling
  • Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products
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    • Ms.  Shengwen

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