12-layer HDI PCB with 1.6mm FR4-TG170, 1.5oz Copper and Immersion Finish, for Phone

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

12-layer HDI PCB with 1.6mm FR4-TG170, 1.5oz copper immersionfinish, for phone

Capability:

Layer: 1 to 28
Board finished thickness: 0.21 to 7.0mm
Material: FR-4, CEM-1, EM-3, High TG, FR4 halogen free androgers
Max. finished board size: 23 x 25mm (580 x 900mm)
Min. drilled hole size: 3mil (0.075mm)
Min. line width: 3mil (0.075mm)
Min. line spacing: 3mil (0.075mm)
Surface finish/treatment: HASL/HASL lead free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP and goldplating
Copper thickness: 0.5 to 7.0oz
Solder mask color: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0μm (>1mil)
Inner packing: vacuum packing/plastic bag
Outer packing: standard carton packing
Shape tolerance: ±0.13
Hole tolerance:
- PTH: ±0.076
- NPTH: ±0.05
UL pending
Special requirements: buried and blind vias, controlledimpedance and BGA
Profiling: punching, routing, V-cut and beveling