Multilayer HDI Electronic PCB with 1.6mm, FR4, TG 170, Immersion Finish

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Basic Info

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Product Description

Specifications:

Layer: 1 to 28
Board finished thickness: 0.21 to 7.0mm
Material: FR-4, CEM-1,CEM-3, High TG, FR4 halogen free,rogers
Finished board size: 23 × 25-inch
Drilled hole size: 3-mil (0.075mm)
Line width: 3-mil (0.075mm)
Line spacing: 3-mil (0.075mm)
Surface finish/treatment : HASL / HASL lead free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP, gold plating
Copper thickness: 0.5 to 7.0oz
Solder mask color: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0um
Inner packing: vacuum packing/plastic bag
Outer packing: standard carton packing
Shape tolerance: ±0.13
Hole tolerance:
- PTH: ±0.076
- NPTH: ±0.05
Special requirements: buried and blind vias + controlledimpedance + BGA
Profiling: punching, routing, V-cut, beveling

Disclaimer: All trademarks shown here are for referencepurposes only. They are the property of their respective owners,and we are not authorized to sell items bearing suchtrademarks.

Layer: 1 to 28

Board finished thickness: 0.21 to 7.0mm

Material: FR-4, CEM-1,CEM-3, High TG, FR4 halogen free,rogers

Finished board size: 23 × 25-inch

Drilled hole size: 3-mil (0.075mm)

Line width: 3-mil (0.075mm)

Line spacing: 3-mil (0.075mm)

Surface finish/treatment : HASL / HASL lead free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP, gold plating

Copper thickness: 0.5 to 7.0oz

Solder mask color: green/yellow/black/white/red/blue

Copper thickness in hole: >25.0um

Inner packing: vacuum packing/plastic bag