Professional Printed Circuit Board Assembly with 8-layer, 1oz Copper Immersion Gold Finish

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Layers: 1 to 28

Board finished thickness: 0.21 to 7.0mm

Materials: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free,Rogers

Maximum finished board size: 23 x 25 (580 x 900)

Minimum drilled hole size: 3 mils (0.075mm)

Minimum line width: 3 mils (0.075mm)

Minimum line spacing: 3 mils (0.075mm)

Surface finish/treatment: HASL/HASL lead free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP, gold plating

Copper thickness: 0.5 to 7.0oz

Solder mask color: green/yellow/black/white/red/blue

Copper thickness in hole: >25.0um (>1 mil)

Inner packing: vacuum packing/plastic bag

Outer packing: standard carton packing

Shape tolerance: ±0.13

Hole tolerance:

Certificate: UL

Special requirements: buried and blind via + controlledimpedance + BGA

Profiling: punching, routing, V-CUT, beveling

Provides OEM services to any sorts of printed circuit boardassembly as well as electronic encased products

PTH: ±0.076

NPTH: ±0.05

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