4-layer PCB with 2.0mm Board Thickness, 2oz Copper Thickness and Immersion Finishing for Battery
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- Layer: 1 to 28
- Board finishing thickness: 0.21 to 7.0mm
- Materials: FR-4, CEM-1, CEM-3, high TG, FR4 halogen-free andRogers
- Finishing board size: 23 x 25mm (580 x 900mm) (maximum)
- Drilled hole size: 3 mils (0.075mm) (minimum)
- Line width: 3 mils (0.075mm) (minimum)
- Line spacing: 3 mils (0.075mm) (minimum)
- Surface finishing/treatment: HASL/HASL lead-free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP and goldplating
- Copper thickness: 0.5 to 7.0oz
- Solder mask color: green/yellow/black/white/red/blue
- Copper thickness in hole: >25.0μm (>1 mil)
- Shape tolerance: ±0.13
- Hole tolerance:
- PTH: ±0.076
- NPTH: ±0.05
- UL pending
- Special requirements: buried and blind via, controlledimpedance and BGA
- Profiling: punching, routing, V-cut and beveling
- PTH: ±0.076
- NPTH: ±0.05
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