One Layer Flexible PCB Made of Flexible, FR4, Mobile PCB, Designs Assembly and Electronic Board

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Our fabrication capacity for PCB:

Layer counts: 1 to 28
Materials: FR-4, CEM-1, CEM-3, High TG, FR4 halogen free androgers
Board finished thickness: 0.21 to 7.0mm
Finished board size: 23 x 25 (580mm) (maximum)
Drilled hole size: 3-mil (0.075mm) (minimum)
Line width: 3-mil (0.075mm) (minimum)
Line spacing: 3-mil (0.075mm) (minimum)
Surface finish/treatment: HASL lead free, HAL, chemical tin,chemical gold, immersion silver/gold, OSP and gold plating
Copper thickness: 0.5 to 7.0oz
Solder mask color: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0um (>1-mil)
Inner packing: vacuum packing/plastic bag
Outer packing: standard carton packing
Shape tolerance: ±0.13
Hole tolerance:
- PTH: ±0.076
- NPTH: ±0.05
Certificate: UL-approved
Special requirements: buried and blind vias + controlledimpedance + BGA
Profiling: punching, routing, V-cut and beveling
Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products

Disclaimer: All trademarks shown here are for referencepurposes only. They are the property of their respective owners,and we are not authorized to sell items bearing suchtrademarks.

Layer counts: 1 to 28

Materials: FR-4, CEM-1, CEM-3, High TG, FR4 halogen free androgers

Board finished thickness: 0.21 to 7.0mm

Finished board size: 23 x 25 (580mm) (maximum)

Drilled hole size: 3-mil (0.075mm) (minimum)

Line width: 3-mil (0.075mm) (minimum)

Line spacing: 3-mil (0.075mm) (minimum)

Surface finish/treatment: HASL lead free, HAL, chemical tin,chemical gold, immersion silver/gold, OSP and gold plating

Copper thickness: 0.5 to 7.0oz

Solder mask color: green/yellow/black/white/red/blue

Copper thickness in hole: >25.0um (>1-mil)

Inner packing: vacuum packing/plastic bag