Flexible PCB with 1.0mm Polymide Material, 0.5 to 7.0oz Copper and Immersion Gold Finish

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Basic Info

Payment Type:	Telegraphic Transfer (TT,T/T)

Product Description

Capability for rigid PCB:

Layer: 1 to 28
Board finished thickness: 0.21 to 7.0mm
Material: FR-4, CEM-1, CEM-3, High-TG, FR4 halogen free androgers
Finished board size: 23 × 25mm (580 x 900mm)(maximum)
Drilled hole size: 3 mils (0.075mm) (minimum)
Line width: 3 mils (0.075mm) (minimum)
Line spacing: 3 mils (0.075mm) (minimum)
Surface finish/treatment: HASL/HASL lead-free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP and goldplating
Copper thickness: 0.5 to 7.0oZ
Solder mask color: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0μm (>1 mil)
Inner packing: vacuum packing/plastic bag
Outer packing: standard carton packing
Shape tolerance: ±0.13
Hole tolerance:
- PTH: ±0.076 and NPTH: ±0.05
Certificate: UL
Special requirements: buried and blind via + controlledimpedance + BGA
Profiling: punching, routing, V-cut and beveling
Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products

Disclaimer: All trademarks shown here are for referencepurposes only. They are the property of their respective owners,and we are not authorized to sell items bearing suchtrademarks.

Layer: 1 to 28

Board finished thickness: 0.21 to 7.0mm

Material: FR-4, CEM-1, CEM-3, High-TG, FR4 halogen free androgers

Finished board size: 23 × 25mm (580 x 900mm)(maximum)

Drilled hole size: 3 mils (0.075mm) (minimum)

Line width: 3 mils (0.075mm) (minimum)

Line spacing: 3 mils (0.075mm) (minimum)

Surface finish/treatment: HASL/HASL lead-free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP and goldplating

Copper thickness: 0.5 to 7.0oZ

Solder mask color: green/yellow/black/white/red/blue

Copper thickness in hole: >25.0μm (>1 mil)

Inner packing: vacuum packing/plastic bag