Multilayer PCB with Gold Finish, Prototype and Mass Production, No MOQ

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Basic Info

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Product Description

Standard PCB layers: 1 to 26 layers

Materials: FR4, high-170 FR4, halogen-free FR4, aluminum base, PTFE, Rogers, polyimide (FPCB)

Surface finishing: electroless NI/AU-immersion gold (ENIG), electrolytic NI/AU-plating gold, HASL (SMOBC), lead-free HAL (hot air leveling), OSP, immersion tin, immersion silver, hald gold connectors/fingers

Specials: HDI, laser drilling, micro blind/buried vias, high-frequency, mixed core, aluminum base, heavy copper (2oz=70um, 3oz=105um, 4oz=140um), halogen-free, impedance, edge plated, half PTH, peelable mask, flat winding, counter sink holes, thick hard gold (AU 50u-inch), gold connectors (Au 50u-inch) and more

Minimum track space: 4/4, 3 mils partial allowed

Minimum CNC hole size: 0.15mm

Minimum laser via size: 0.1mm

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