
14-layer PCB with HDI design, mini via 0.1mm, min track and space 3/3mil, BGA
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Product Description
Product Description
- HDI, laser drilling, micro blind/buried vias, high-frequency, mixed core, aluminum base, heavy copper (2Oz=70um, 3Oz=105um, 4oz=140um), halogen-free, impedance, edge plated, half PTH, peelable mask, flat winding, counter sink holes, thick hard gold (AU 50u-inch), gold connectors (Au 50u-inch) and more
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