Multilayer PCB with Immersion Gold, Prototype and Mass Production $ No MOQ
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- FR4, high-170 FR4, halogen-free FR4, aluminum base, PTFE, Rogers, polyimide (FPCB)
- Electroless NI/AU-immersion gold (ENIG), electrolytic NI/AU-plating gold, HASL (SMOBC), lead-free HAL (hot air leveling), OSP, immersion tin, immersion silver, hard gold connectors/fingers
- HDI, laser drilling, micro blind/buried vias, high-frequency, mixed core, aluminum base, heavy copper (2Oz=70um, 3Oz=105um, 4oz=140um), halogen-free, impedance, edge plated, half PTH, peelable mask, flat winding, counter sink holes, thick hard gold (AU 50u-inch), gold connectors (Au 50u-inch) and more
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