Multilayer PCB with flat winding, quick-turn and mass production, no MOQ
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- Standard PCB layers: 1 to 26 layers
- Materials: FR4, high-170 FR4, halogen-free FR4, aluminum base, PTFE, Rogers, polyimide (FPCB)
- Surface finishing: electroless Ni/AU-immersion gold (ENIG), electrolytic Ni/AU-plating gold, HASL (SMOBC), lead-free HAL (hot air leveling), OSP, immersion tin, immersion silver, hard gold connectors/fingers
- Specials: HDI, laser drilling, micro blind/buried vias, high-frequency, mixed core, aluminum base, heavy copper (2oz = 70um, 3oz = 105um, 4oz = 140um), halogen-free, impedance, edge plated, half PTH, peelable mask, flat winding, counter sink holes, thick hard gold (AU 50u-inch), gold connectors (Au 50u-inch) and more
- Minimum track space: 3/3-mil
- Minimum CNC hole size: 0.15mm
- Minimum laser via size: 0.1mm
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