Shenzhen Hongmy Precision Circuit Co. Ltd
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Products
Shenzhen Hongmy Precision Circuit Co. Ltd
4-layer PCBs with Lead Free HASL Finish, 0.25mm Minimum Hole Diameter
  • 4-layer PCBs with Lead Free HASL Finish, 0.25mm Minimum Hole Diameter
4-layer PCBs with Lead Free HASL Finish, 0.25mm Minimum Hole Diameter

4-layer PCBs with Lead Free HASL Finish, 0.25mm Minimum Hole Diameter

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Basic Info
Basic Info
Payment Type: T/T, L/C or Western Union
Product Description
Product Description
  • Specifications:
    • Minimum hole diameter: 0.25mm
    • Minimum line width: 0.1mm
    • Minimum line spacing: 0.1mm
    • Surface finish: lead free HASL
    • Solder mask: green
    • Certificates:
      • UL and RoHS
      • RoHS: A001C100827049001-2
      • SGS: CANEC1000312001
      • UL: E320045
    • Materials: FR-4/Hi Tg FR-4/lead-free materials (RoHScompliant)/CEM-3, aluminum, metal based
    • Layer number: 1 to 16
    • Finished board thickness: 0.2 to 3.8mm (8 to 150-mil)
    • Board thickness tolerance: ±10%
    • Cooper thickness: 0.5 to 6oz (18 to 210um)
    • Copper plating hole: 18 to 40um
    • Impedance control: ±10%
    • Warp and twist: 0.70%
    • Peelable (0.3 x 0.5mm): 0.012 to 0.02 inches
  • Images:
    • Minimum trace width: 0.075mm (3-mil)
    • Minimum space width: 0.1mm (4-mil)
    • Minimum annular ring: 0.1mm (4-mil)
    • SMD pitch: 0.2mm (8-mil)
    • BGA pitch: 0.2mm (8-mil)
  • Solder mask:
    • Minimum solder mask dam: 0.0635mm (2.5-mil)
    • Solder mask clearance: 0.1mm (4-mil)
    • Minimum SMT pad spacing: 0.1mm (4-mil)
    • Solder ask thickness: 0.0007 inches (0.018mm)
  • Minimum hole diameter: 0.25mm
  • Minimum line width: 0.1mm
  • Minimum line spacing: 0.1mm
  • Surface finish: lead free HASL
  • Solder mask: green
  • Certificates:
    • UL and RoHS
    • RoHS: A001C100827049001-2
    • SGS: CANEC1000312001
    • UL: E320045
  • Materials: FR-4/Hi Tg FR-4/lead-free materials (RoHScompliant)/CEM-3, aluminum, metal based
  • Layer number: 1 to 16
  • Finished board thickness: 0.2 to 3.8mm (8 to 150-mil)
  • Board thickness tolerance: ±10%
  • Cooper thickness: 0.5 to 6oz (18 to 210um)
  • Copper plating hole: 18 to 40um
  • Impedance control: ±10%
  • Warp and twist: 0.70%
  • Peelable (0.3 x 0.5mm): 0.012 to 0.02 inches
  • UL and RoHS
  • RoHS: A001C100827049001-2
  • SGS: CANEC1000312001
  • UL: E320045
  • Minimum trace width: 0.075mm (3-mil)
  • Minimum space width: 0.1mm (4-mil)
  • Minimum annular ring: 0.1mm (4-mil)
  • SMD pitch: 0.2mm (8-mil)
  • BGA pitch: 0.2mm (8-mil)
  • Minimum solder mask dam: 0.0635mm (2.5-mil)
  • Solder mask clearance: 0.1mm (4-mil)
  • Minimum SMT pad spacing: 0.1mm (4-mil)
  • Solder ask thickness: 0.0007 inches (0.018mm)

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