Electronic Board with Tg150 and Immersion Gold Surface Finishing
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- Layers: 4
- Board materials: FR4, Tg150
- Board thickness: 0.062-inch
- Surface finish: immersion gold
- Copper thickness: 1oz outer layer, 0.5oz inner layer
- Solder mask: green
- Minimum trace width/gap: 0.15mm (minimum)
- Aperture: 0.3mm (minimum)
- Peel strength: 1.25
- Solder blister resistance: ≥60 (288°C)
- Flammability: UL94 V0
- Outline tolerance: (CNC) 0.125 and (punching) 0.15mm
- Warp and twist: 0.70%
- Minimum solder mask bridge: 0.0635mm
- Minimum distance between line to board bridge: (outline) 0.25and (v-cut) 0.40mm
- Impedance control tolerance: ±10%
- Test voltage: 10 to 300V
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