Shenzhen Hongmy Precision Circuit Co. Ltd
Products
Products
Shenzhen Hongmy Precision Circuit Co. Ltd
FR-4 Green Solder Mask Immersion Gold PCB with BJA, Ideal for Mobile Phones
  • FR-4 Green Solder Mask Immersion Gold PCB with BJA, Ideal for Mobile Phones
FR-4 Green Solder Mask Immersion Gold PCB with BJA, Ideal for Mobile Phones

FR-4 Green Solder Mask Immersion Gold PCB with BJA, Ideal for Mobile Phones

Get Latest Price
Payment Type:
T/T, L/C at Sight or Western Union
Quantity:

Your message must be between 20 to 2000 characters

Contact Now
Basic Info
Basic Info
Payment Type: T/T, L/C at Sight or Western Union
Product Description
Product Description
  • Specifications:
    • Layers: 1 to 20
    • Materials: FR-4, CEM-1, aluminum, rogers, ta-conic, Gerek andArlin
    • Finishing board thickness: 0.2 to 3.2mm
    • External copper thickness: 35 to 210um
    • Internal copper thickness: 17 to 140um
    • Copper plating hole: 18 to 40um
    • Trace width and line spacing: 0.075/0.1mm (3/4-mil)
    • CNC hole diameter: 0.20mm (minimum)
    • Punching hole diameter: 0.9mm/35-mil (minimum)
    • Panel size: 610 x 508mm (maximum)
    • Hole position tolerance: 0.075mm
    • Hole dimension tolerance: 0.075 (PTH) and 0.05mm (NPTH)
    • Outline tolerance: 0.125 (CNS) and 0.15mm (punching)
    • Warp and twist: 0.70%
    • Solder mask bridge: 0.0635mm (minimum)
    • Distance between lines to board bridge: 0.25 (minimum/outline)and 0.40mm (V-cut)
    • Impedance control tolerance: ±10%
    • Test voltages: 10 to 300V
  • Solder mask types: green, yellow, red, white, blue, mattegreen, matte black and more
  • Surface finishing: HASL, immersion gold, immersion silver,gold-plated, gold finger and OSP
  • Layers: 1 to 20
  • Materials: FR-4, CEM-1, aluminum, rogers, ta-conic, Gerek andArlin
  • Finishing board thickness: 0.2 to 3.2mm
  • External copper thickness: 35 to 210um
  • Internal copper thickness: 17 to 140um
  • Copper plating hole: 18 to 40um
  • Trace width and line spacing: 0.075/0.1mm (3/4-mil)
  • CNC hole diameter: 0.20mm (minimum)
  • Punching hole diameter: 0.9mm/35-mil (minimum)
  • Panel size: 610 x 508mm (maximum)
  • Hole position tolerance: 0.075mm
  • Hole dimension tolerance: 0.075 (PTH) and 0.05mm (NPTH)
  • Outline tolerance: 0.125 (CNS) and 0.15mm (punching)
  • Warp and twist: 0.70%
  • Solder mask bridge: 0.0635mm (minimum)
  • Distance between lines to board bridge: 0.25 (minimum/outline)and 0.40mm (V-cut)
  • Impedance control tolerance: ±10%
  • Test voltages: 10 to 300V

    • Send your message to this supplier

    • Mr.  Peng Representative

    • Enter between 20 to 4,000 characters.

    Related Products

    Related Keywords

    Related Keywords
    Related Products
    Product Categories