Multilayer Circuit Board with 2.0mm Board, Made of FR4 Material

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Basic Info

Payment Type:	T/T, L/C or Western Union

Product Description

Layers count: 8

Board material: FR4

Board thickness: 2.0mm

Finished copper thickness: 1oz

Minimum drilling diameter: 8mil

Surface finish: OSP

Hongmy manufacture capability:

Materials: FR-4, CEM-1, aluminum, Rogers, ta-conic, Gerek andArlin
Finish board thickness: 0.2 to 3.2mm
External copper thickness: 35 to 210um
Internal copper thickness: 17 to 140um
Copper plating hole: 18 to 40um
Trace width and line spacing: 0.075/0.1mm (3/4 mils)
CNC hole diameter: 0.20mm (minimum)
Punching hole diameter: 0.9mm (35 mils) (minimum)
Panel size: 610 x 508mm (maximum)
Hole position tolerance: 0.075mm
Hole dimension tolerance: 0.075 (PTH) and 0.05mm (NPTH)
Outline tolerance: 0.125 (CNS) and 0.15mm (punching)
Warp and twist: 0.70%
Solder mask bridge: 0.0635mm (minimum)
Distance between lines to board bridge: 0.25 (minimum)(outline) and 0.40mm (v-cut)
Impedance control tolerance: ±10%
Test voltage: 10 to 300V
Solder mask types: green, yellow, red, white, blue, mattegreen, matte black and more
Surface finished: HASL, immersion gold, immersion silver,gold-plated, gold finger and OSP