Shenzhen Hongmy Precision Circuit Co. Ltd
Shenzhen Hongmy Precision Circuit Co. Ltd
Multi-layer Immersion Gold Circuit Board, Made of FR-4 Base Material with 2oz Copper Thickness
  • Multi-layer Immersion Gold Circuit Board, Made of FR-4 Base Material with 2oz Copper Thickness
Multi-layer Immersion Gold Circuit Board, Made of FR-4 Base Material with 2oz Copper Thickness

Multi-layer Immersion Gold Circuit Board, Made of FR-4 Base Material with 2oz Copper Thickness

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Basic Info
Basic Info
Payment Type: TT in Advance, PayPal, Western Union
Product Description
Product Description
  • Features:
    • Number of layers: 4
    • Base material: FR-4
    • Copper thickness: 2oz
    • Board thickness: 1.6mm
    • Minimum hole size: 0.2mm
    • Minimum line width: 0.15mm
    • Minimum line spacing: 0.12mm
    • No MOQ
  • Number of layers: 4
  • Base material: FR-4
  • Copper thickness: 2oz
  • Board thickness: 1.6mm
  • Minimum hole size: 0.2mm
  • Minimum line width: 0.15mm
  • Minimum line spacing: 0.12mm
  • No MOQ
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