Shenzhen Hongmy Precision Circuit Co. Ltd
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Shenzhen Hongmy Precision Circuit Co. Ltd
Multilayer PCBs with 0.2mm BGA Hole Diameter and FR-4 Material, 1.6mm Board Thickness
  • Multilayer PCBs with 0.2mm BGA Hole Diameter and FR-4 Material, 1.6mm Board Thickness
Multilayer PCBs with 0.2mm BGA Hole Diameter and FR-4 Material, 1.6mm Board Thickness

Multilayer PCBs with 0.2mm BGA Hole Diameter and FR-4 Material, 1.6mm Board Thickness

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Basic Info
Basic Info
Payment Type: T/T, PayPal or Western Union
Product Description
Product Description
  • Specifications:
    • Materials: FR-4/Hi Tg FR-4/lead-free materials (RoHScompliant)/CEM-3, aluminum, metal based
    • Layer numbers: 1 to 16
    • Finished board thickness: 0.2 to 3.8mm (8 to 150m)
    • Board thickness tolerance: ±10%
    • Cooper thickness: 0.5 to 6oz (18 to 210um)
    • Copper plating hole: 18 to 40um
    • Impedance control: ±10%
    • Warp/twist: 0.70%
    • Peel able: 0.012 to 0.02 (0.3 to 0.5mm)
    • Images:
      • Minimum trace width: 0.075mm
      • Minimum space width: 0.1mm
      • Minimum annular ring: 0.1mm
      • SMD pitch: 0.2mm
      • BGA pitch: 0.2, 0.05mm
    • Solder mask:
      • Minimum solder mask dam: 0.0635mm
      • Solder mask clearance: 0.1mm
      • Minimum SMT Pad spacing: 0.1mm
      • Solder mask thickness: 0.0007 inches
  • Features:
    • Multi-layer PCBs with BGA
    • Board material: FR4
    • Flammability: UL 94V
    • Board thickness: 1.6mm
    • Copper thickness: 35um
    • Minimum hole diameter: 0.2mm
    • Minimum line width: 0.15mm
    • Minimum line spacing: 0.2mm
  • Materials: FR-4/Hi Tg FR-4/lead-free materials (RoHScompliant)/CEM-3, aluminum, metal based
  • Layer numbers: 1 to 16
  • Finished board thickness: 0.2 to 3.8mm (8 to 150m)
  • Board thickness tolerance: ±10%
  • Cooper thickness: 0.5 to 6oz (18 to 210um)
  • Copper plating hole: 18 to 40um
  • Impedance control: ±10%
  • Warp/twist: 0.70%
  • Peel able: 0.012 to 0.02 (0.3 to 0.5mm)
  • Images:
    • Minimum trace width: 0.075mm
    • Minimum space width: 0.1mm
    • Minimum annular ring: 0.1mm
    • SMD pitch: 0.2mm
    • BGA pitch: 0.2, 0.05mm
  • Solder mask:
    • Minimum solder mask dam: 0.0635mm
    • Solder mask clearance: 0.1mm
    • Minimum SMT Pad spacing: 0.1mm
    • Solder mask thickness: 0.0007 inches
  • Minimum trace width: 0.075mm
  • Minimum space width: 0.1mm
  • Minimum annular ring: 0.1mm
  • SMD pitch: 0.2mm
  • BGA pitch: 0.2, 0.05mm
  • Minimum solder mask dam: 0.0635mm
  • Solder mask clearance: 0.1mm
  • Minimum SMT Pad spacing: 0.1mm
  • Solder mask thickness: 0.0007 inches
  • Multi-layer PCBs with BGA
  • Board material: FR4
  • Flammability: UL 94V
  • Board thickness: 1.6mm
  • Copper thickness: 35um
  • Minimum hole diameter: 0.2mm
  • Minimum line width: 0.15mm
  • Minimum line spacing: 0.2mm

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