Four-layer Circuit Board with 2oz Outer Layer Copper and FR4 Base Material

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Basic Info

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Product Description

Number of layers: 4

Base material: FR4

Finished board thickness: 1.6mm

Copper thickness:

Surface finishing: lead-free HASL

Manufacture capability

Available in 1 to 16 layers

Materials: FR4, aluminum base, rogers and taconic

Finish board thickness: 0.2 to 3.2mm (8 to 126-mil)

External copper thickness: 35 to 210um

Internal copper thickness: 17 to 140um

Copper plating hole: 18 to 40um

Trace width and line spacing: 0.075/0.1mm (3/4-mil)(minimum)

Hole dimensions (CNC): 0.20mm (8-mil) (minimum)

Hole dimensions (punching): 0.9mm (35-mil) (minimum)

Panel dimensions: 610 x 508mm (maximum)

Hole position tolerance (CNC): ±0.075mm

Hole dimensions tolerance (CNC):

Outline tolerance (CNC): ±0.125mm, punching: ±0.15mm

Warp and twist: 0.70%

Solder mask bridge: 0.0635mm (minimum)

Distance between line to board edge

Outline: 0.25mm

V-cut: 0.40mm

Impedance control tolerance: ± 10%

Test voltage: 10 to 300V

Solder mask types: green, yellow, red, white, blue, matte green, matte black and more

Surface finishing: HASL, immersed silver/gold, plate gold and gold finger

Outer layer: 2oz

Inner layer: 1oz

Hole size: 0.25mm (minimum)

Line width: 0.25mm (minimum)

Line spacing: 0.3mm (minimum)

PTH: ±0.075mm

NPTH: ±0.05mm

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