Shenzhen Hongmy Precision Circuit Co. Ltd
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Products
Shenzhen Hongmy Precision Circuit Co. Ltd
4 Layers PCB with Immersion Gold Surface Finish and 2oz Outer Layer, Copper Thickness for Mobile
  • 4 Layers PCB with Immersion Gold Surface Finish and 2oz Outer Layer, Copper Thickness for Mobile
4 Layers PCB with Immersion Gold Surface Finish and 2oz Outer Layer, Copper Thickness for Mobile

4 Layers PCB with Immersion Gold Surface Finish and 2oz Outer Layer, Copper Thickness for Mobile

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Basic Info
Basic Info
Payment Type: T/T, PayPal, Western Union
Product Description
Product Description
  • Features:
    • Number of layers: four
    • Base material: FR4
    • Finished board thickness: 1.6mm
    • Copper thickness:
      • Outer layer: 2oz
      • Inner layer: 1oz
    • Minimum hole size: 0.11mm
    • Minimum line width: 0.075mm
    • Minimum line spacing: 0.1mm
    • Surface finishing: immersion gold
  • Our product range:
    • We offer a wide range of PCBs such as single-sided,double-sided, multiple layers, high- frequency, MCPCB, metal-backedPCB and more
  • Product quality:
    • Our factories got UL certificate and our products meet RoHSstandards
    • RoHS: A001C100827049001-2
    • SGS: CANEC1000312001
    • UL: E320045
    • If our PCBs can meet your requirements, welcome to receive yourinquiry or trial order for testing our price and quality
    • We will quote to you the best price for your reference as soonas we receive your specific inquiry
  • Specifications:
    • Item manufacture capability
    • Materials: FR-4/Hi Tg FR-4/lead-free materials (RoHScompliant)/CEM-3, aluminum, metal based
    • Layer number: 1 to 16
    • Finished board thickness: 0.2 to 3.8mm (8 to 150-mil)
    • Board thickness tolerance: ±10%
    • Cooper thicknesses: 0.5 to 6oz (18 to 210um)
    • Copper plating hole: 18 to 40um
    • Impedance control: ±10%
    • Warp/twist: 0.70%
    • Peelable: 0.012 to 0.02 (0.3 to 0.5mm)
    • Images:
      • Minimum trace width (a): 0.075mm (3-mil)
      • Minimum space width (b): 0.1mm (4-mil)
      • Minimum annular ring: 0.1mm (4-mil)
      • SMD pitch (a): 0.2mm (8-mil)
      • BGA pitch (b): 0.2mm (8-mil), 0.05mm
    • Solder mask:
      • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
      • Solder mask clearance (b): 0.1mm (4-mil)
      • Minimum SMT Pad spacing (c): 0.1mm (4mil)
  • Number of layers: four
  • Base material: FR4
  • Finished board thickness: 1.6mm
  • Copper thickness:
    • Outer layer: 2oz
    • Inner layer: 1oz
  • Minimum hole size: 0.11mm
  • Minimum line width: 0.075mm
  • Minimum line spacing: 0.1mm
  • Surface finishing: immersion gold
  • Outer layer: 2oz
  • Inner layer: 1oz
  • We offer a wide range of PCBs such as single-sided,double-sided, multiple layers, high- frequency, MCPCB, metal-backedPCB and more
  • Our factories got UL certificate and our products meet RoHSstandards
  • RoHS: A001C100827049001-2
  • SGS: CANEC1000312001
  • UL: E320045
  • If our PCBs can meet your requirements, welcome to receive yourinquiry or trial order for testing our price and quality
  • We will quote to you the best price for your reference as soonas we receive your specific inquiry
  • Item manufacture capability
  • Materials: FR-4/Hi Tg FR-4/lead-free materials (RoHScompliant)/CEM-3, aluminum, metal based
  • Layer number: 1 to 16
  • Finished board thickness: 0.2 to 3.8mm (8 to 150-mil)
  • Board thickness tolerance: ±10%
  • Cooper thicknesses: 0.5 to 6oz (18 to 210um)
  • Copper plating hole: 18 to 40um
  • Impedance control: ±10%
  • Warp/twist: 0.70%
  • Peelable: 0.012 to 0.02 (0.3 to 0.5mm)
  • Images:
    • Minimum trace width (a): 0.075mm (3-mil)
    • Minimum space width (b): 0.1mm (4-mil)
    • Minimum annular ring: 0.1mm (4-mil)
    • SMD pitch (a): 0.2mm (8-mil)
    • BGA pitch (b): 0.2mm (8-mil), 0.05mm
  • Solder mask:
    • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
    • Solder mask clearance (b): 0.1mm (4-mil)
    • Minimum SMT Pad spacing (c): 0.1mm (4mil)
  • Minimum trace width (a): 0.075mm (3-mil)
  • Minimum space width (b): 0.1mm (4-mil)
  • Minimum annular ring: 0.1mm (4-mil)
  • SMD pitch (a): 0.2mm (8-mil)
  • BGA pitch (b): 0.2mm (8-mil), 0.05mm
  • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
  • Solder mask clearance (b): 0.1mm (4-mil)
  • Minimum SMT Pad spacing (c): 0.1mm (4mil)

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