High-density Multilayer PCB with 0.4mm Minimum Hole Diameter, Made of FR4 Material
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Four-layered PCB with 3oz Copper Thickness on all Layers and BGA Included
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Double-sided PCB with 2.0 to 3.2 Board Thicknesses and Voltage of 10 to 300V
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Multilayer PCB with Immersion Gold Surface and Green Solder Mask
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Multilayer PCB with Immersion Gold and Heavy Copper, 1 to 20 Layers and 10 to 300V Test Voltage
Related Keywords
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Four-layered PCB with 3oz Copper Thickness on all Layers and BGA Included
Double-sided PCB with 2.0 to 3.2 Board Thicknesses and Voltage of 10 to 300V
Multilayer PCB with Immersion Gold Surface and Green Solder Mask
Multilayer PCB with Immersion Gold and Heavy Copper, 1 to 20 Layers and 10 to 300V Test Voltage
PCB Board with Blue Solder Mask and Hasl Finishing
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Double-sided PCB Circuit with FR4 Base and Immersion Gold Surface and 0.2mm Minimum Hole
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Multilayer PCB with Green Solder Mask and 2 oz Copper Thickness
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