FR4 High-density Multi-layered PCB with 1.6mm Thickness

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Basic Info

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Product Description

Specifications:

With FR4 base
Immersion gold
Line width/space: 0.1/0.1mm (minimum)
With UL, SGS and RoHS marks
Board thickness: 0.4 to 3.2mm
Line width: 0.1mm (minimum)
Line spacing: 0.1mm (minimum)
Hole size: 0.2mm (minimum)
Surface finishing: HASL, immersion tin, gold plating, OSP and immersion silver
Available in 1 to 12 layers
Dimensions: 1,100 x 480mm (maximum)
Dimensions: 5 x 5mm (minimum)
Trace and line spacing: 0.1mm (minimum)
Warp and twist: <0.5mm
- Thickness: 1.6mm
- Dimensions: 300 x 300mm
Finished product thickness: 0.2 to 4.5mm
Copper thickness: 18, 35, 70, 105 and 140μm
Hole inner copper thickness: 18 to 40μm
Hole position tolerance: ±0.075mm
Minimum punching hole diameter:
- Board thickness <1.0mm: 1.0mm
- Board thickness: 1.2 to 3.0mm: 1.5mm
Other specifications:
- Board thickness: <1.0mm: 0.8 x 0.8mm
- Board thickness: 1.2 to 3.0mm: 1.0 x 1.0mm
Silk prints circuit tolerance: ±0.075mm
Outline tolerance:
- CNC: ±0.1mm
- Mold: ±0.75mm
Minimum whole size: 0.2mm
No limitation in maximum hole dimensions
V-cut angle deviation: ±0.5°
V-cut board thickness range: 0.6 to 3.2mm
Minimum component mark character style: 0.15mm
Minimum open window for PADs: 0.01mm
Solder masks: green, white, blue, matte black and gray