Shenzhen Hongmy Precision Circuit Co. Ltd
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Shenzhen Hongmy Precision Circuit Co. Ltd
Double-sided PCB with 3oz Copper Thickness and 0.2mm Minimum Hole Diameter
  • Double-sided PCB with 3oz Copper Thickness and 0.2mm Minimum Hole Diameter
Double-sided PCB with 3oz Copper Thickness and 0.2mm Minimum Hole Diameter

Double-sided PCB with 3oz Copper Thickness and 0.2mm Minimum Hole Diameter

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Basic Info
Basic Info
Payment Type: T/T, L/C at Sight, Western Union or PayPal
Product Description
Product Description
  • Specifications:
    • Material: FR-4/Hi Tg FR-4/lead free materials (RoHSdirective-compliant)/CEM-3, aluminum, metal based
    • Layers: 1 to 16
    • Finished board thickness: 0.2 to 3.8mm (8 to 150mm)
    • Board thickness tolerance: ±10%
    • Cooper thickness: 0.5 to 6oz (18 to 210um)
    • Copper plating hole: 18 to 40um
    • Impedance control: ±10%
    • Warp and twist: 0.70%
    • Peelable: 0.012 (0.3mm) to 0.02 inches (0.5mm)
    • Images:
      • Trace width (a): 0.075mm (3 mils) (minimum)
      • Space width (b): 0.1mm (4 mils) (minimum)
      • Annular ring: 0.1mm (4 mils)
      • SMD pitch (a): 0.2mm (8 mils)
      • BGA pitch (b): 0.2mm (8 mils)
    • Solder mask:
      • Solder mask dam (a): 0.0635mm (2.5mils) (minimum)
      • Solder mask clearance (b): 0.1mm (4 mils)
      • SMT pad spacing (c): 0.1mm (4 mils) (minimum)
      • Solder mask thickness: 0.0007 inches (0.018mm)
    • Holes:
      • Hole size (CNC): 0.2mm (8 mils) (minimum)
      • Punch hole size: 0.9 mm (35 mils) 9minimum)
  • Material: FR-4/Hi Tg FR-4/lead free materials (RoHSdirective-compliant)/CEM-3, aluminum, metal based
  • Layers: 1 to 16
  • Finished board thickness: 0.2 to 3.8mm (8 to 150mm)
  • Board thickness tolerance: ±10%
  • Cooper thickness: 0.5 to 6oz (18 to 210um)
  • Copper plating hole: 18 to 40um
  • Impedance control: ±10%
  • Warp and twist: 0.70%
  • Peelable: 0.012 (0.3mm) to 0.02 inches (0.5mm)
  • Images:
    • Trace width (a): 0.075mm (3 mils) (minimum)
    • Space width (b): 0.1mm (4 mils) (minimum)
    • Annular ring: 0.1mm (4 mils)
    • SMD pitch (a): 0.2mm (8 mils)
    • BGA pitch (b): 0.2mm (8 mils)
  • Solder mask:
    • Solder mask dam (a): 0.0635mm (2.5mils) (minimum)
    • Solder mask clearance (b): 0.1mm (4 mils)
    • SMT pad spacing (c): 0.1mm (4 mils) (minimum)
    • Solder mask thickness: 0.0007 inches (0.018mm)
  • Holes:
    • Hole size (CNC): 0.2mm (8 mils) (minimum)
    • Punch hole size: 0.9 mm (35 mils) 9minimum)
  • Trace width (a): 0.075mm (3 mils) (minimum)
  • Space width (b): 0.1mm (4 mils) (minimum)
  • Annular ring: 0.1mm (4 mils)
  • SMD pitch (a): 0.2mm (8 mils)
  • BGA pitch (b): 0.2mm (8 mils)
  • Solder mask dam (a): 0.0635mm (2.5mils) (minimum)
  • Solder mask clearance (b): 0.1mm (4 mils)
  • SMT pad spacing (c): 0.1mm (4 mils) (minimum)
  • Solder mask thickness: 0.0007 inches (0.018mm)
  • Hole size (CNC): 0.2mm (8 mils) (minimum)
  • Punch hole size: 0.9 mm (35 mils) 9minimum)

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