Shenzhen Hongmy Precision Circuit Co. Ltd
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Products
Shenzhen Hongmy Precision Circuit Co. Ltd
PCB Boards with 2-layered KB Material and 1.6mm Thickness
  • PCB Boards with 2-layered KB Material and 1.6mm Thickness
PCB Boards with 2-layered KB Material and 1.6mm Thickness

PCB Boards with 2-layered KB Material and 1.6mm Thickness

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Basic Info
Basic Info
Payment Type: T/T, Paypal and Western Union
Product Description
Product Description
  • Specifications:
    • Material: FR-4/high Tg FR-4/lead-free materials (RoHScompliant)/CEM-3, aluminum, metal based
    • Number of layers: 1 to 16
    • Finished board thicknesses: 0.2 to 3.8mm (8 to 150 mils)
    • Board thickness tolerance: ±10%
    • Copper thicknesses: 0.5 to 6oz (18 to 210um)
    • Copper plating holes: 18 to 40um
    • Impedance control: ±10%
    • Warp and twist: 0.70%
    • Peelable: 0.012 (0.3mm) to 0.02 inches (0.5mm)
    • Images:
      • Minimum trace width: 0.075mm (3 mils)
      • Minimum space width: 0.1mm (4 mils)
      • Minimum annular ring: 0.1mm (4 mils)
      • SMD pitch: 0.2mm (8 mils)
      • BGA pitch: 0.2mm (8 mils)
    • Solder mask:
      • Minimum solder mask dam: 0.0635mm (2.5 mils)
      • Solder mask clearance: 0.1mm (4 mils)
      • Minimum SMT pad spacing: 0.1mm (4 mils)
      • Solder mask thickness: 0.0007 inches (0.018mm)
    • Holes:
      • Minimum hole size (CNC): 0.2 mm (8 mils)
      • Minimum punch hole size: 0.9mm (35 mils)
      • Hole size:
        • PTH: ±0.075mm
        • NPTH: ±0.05mm
        • Hole position: ±0.075mm
    • Plating:
      • HASL: 2.5um
      • Lead-free HASL: 2.5um
      • Immersion gold nickel: 3 to 7um (Au: 1 to 5um)
      • OSP: 0.2 to 0.5um
  • Material: FR-4/high Tg FR-4/lead-free materials (RoHScompliant)/CEM-3, aluminum, metal based
  • Number of layers: 1 to 16
  • Finished board thicknesses: 0.2 to 3.8mm (8 to 150 mils)
  • Board thickness tolerance: ±10%
  • Copper thicknesses: 0.5 to 6oz (18 to 210um)
  • Copper plating holes: 18 to 40um
  • Impedance control: ±10%
  • Warp and twist: 0.70%
  • Peelable: 0.012 (0.3mm) to 0.02 inches (0.5mm)
  • Images:
    • Minimum trace width: 0.075mm (3 mils)
    • Minimum space width: 0.1mm (4 mils)
    • Minimum annular ring: 0.1mm (4 mils)
    • SMD pitch: 0.2mm (8 mils)
    • BGA pitch: 0.2mm (8 mils)
  • Solder mask:
    • Minimum solder mask dam: 0.0635mm (2.5 mils)
    • Solder mask clearance: 0.1mm (4 mils)
    • Minimum SMT pad spacing: 0.1mm (4 mils)
    • Solder mask thickness: 0.0007 inches (0.018mm)
  • Holes:
    • Minimum hole size (CNC): 0.2 mm (8 mils)
    • Minimum punch hole size: 0.9mm (35 mils)
    • Hole size:
      • PTH: ±0.075mm
      • NPTH: ±0.05mm
      • Hole position: ±0.075mm
  • Plating:
    • HASL: 2.5um
    • Lead-free HASL: 2.5um
    • Immersion gold nickel: 3 to 7um (Au: 1 to 5um)
    • OSP: 0.2 to 0.5um
  • Minimum trace width: 0.075mm (3 mils)
  • Minimum space width: 0.1mm (4 mils)
  • Minimum annular ring: 0.1mm (4 mils)
  • SMD pitch: 0.2mm (8 mils)
  • BGA pitch: 0.2mm (8 mils)
  • Minimum solder mask dam: 0.0635mm (2.5 mils)
  • Solder mask clearance: 0.1mm (4 mils)
  • Minimum SMT pad spacing: 0.1mm (4 mils)
  • Solder mask thickness: 0.0007 inches (0.018mm)
  • Minimum hole size (CNC): 0.2 mm (8 mils)
  • Minimum punch hole size: 0.9mm (35 mils)
  • Hole size:
    • PTH: ±0.075mm
    • NPTH: ±0.05mm
    • Hole position: ±0.075mm
  • PTH: ±0.075mm
  • NPTH: ±0.05mm
  • Hole position: ±0.075mm
  • HASL: 2.5um
  • Lead-free HASL: 2.5um
  • Immersion gold nickel: 3 to 7um (Au: 1 to 5um)
  • OSP: 0.2 to 0.5um

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