Amplifier PCB Boards with FR4 Material and Green Solder Mask, 0.1mm Line Space

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Basic Info

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Product Description

Specifications:

With FR-4 base
Immersion gold
Line width/space: 0.1/0.1mm (minimum)
With UL, SGS and RoHS marks
Board thickness: 0.4 to 3.2mm
Line width: 0.1mm (minimum)
Line spacing: 0.1mm (minimum)
Hole size: 0.2mm (minimum)
Product type: aluminum/copper/iron base board
Surface finishing: HASL/immersion tin/goldplating/OSP/immersion silver
Layers: 1 to 16 layers
Dimensions: 800 x 400mm (maximum)
Dimensions: 10 x 10 mm (minimum)
Trace and line spacing: 0.1mm (minimum)
Warp and twist: <0.5mm
Finishing product thickness: 0.2 to 4.5mm
Copper thickness: 18-210um
Hole inner copper thickness: 18 to 40μm
Hole position tolerance: ±0.075mm
Minimum punching hole diameter:
- Board thickness <1.0mm: 1.0mm
- Board thickness: 1.2 to 3.0, 1.5mm
Minimum punching square slot specifications:
- Board thickness <1.0mm: 0.8 x 0.8mm
- Board thickness 1.2 to 3.0mm: 1.0 x 1.0mm
Silk prints circuit tolerance: ±0.075mm
Outline tolerance:
- CNC: ±0.1mm
- Mold: ±0.75mm
Minimum whole size: 0.2mm
No limitation in maximum hole dimension
V-cut angle deviation: ±0.5°
V-cut board thickness range: 0.6 to 3.2mm
Minimum component mark character style: 0.15mm
Minimum open window for Pads: 0.01mm
Solder mask: green, white, blue, matte black and gray