Shenzhen Hongmy Precision Circuit Co. Ltd
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Shenzhen Hongmy Precision Circuit Co. Ltd
Double-sided PCB with FR-4 Material and Green Solder Mask
  • Double-sided PCB with FR-4 Material and Green Solder Mask
Double-sided PCB with FR-4 Material and Green Solder Mask

Double-sided PCB with FR-4 Material and Green Solder Mask

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Basic Info
Basic Info
Payment Type: T/T, Paypal or Western Union
Product Description
Product Description
  • Specifications:
    • Minimum whole diameter: 0.4mm
    • Minimum line width: 0.3 mm
    • Minimum line spacing: 0.3 mm
    • Surface finish: lead-free HASL
    • Solder mask: green
    • With UL and RoHS marks
    • RoHS: A001C100827049001-2
    • SGS: CANEC1000312001
    • UL: E320045
    • Material: FR-4/Hi Tg FR-4/lead-free materials (RoHScompliant)/CEM-3, aluminum, metal based
    • Layer number: 1 to 16
    • Finished board thickness: 0.2 to 3.8mm (8 to 150 mils)
    • Board thickness tolerance: ±10%
    • Cooper thickness: 0.5 to 6oz (18 to 210um)
    • Copper plating hole: 18 to 40um
    • Impedance control: ±10%
    • Warp and twist: 0.70%
    • Peel able: 0.012 (0.3mm) to 0.02 inch (0.5mm)
  • Images:
    • Minimum trace width: 0.1mm (4 mils)
    • Minimum space width: 0.1mm (4 mils)
    • Minimum annular ring: 0.1mm (4 mils)
    • SMD pitch: 0.2mm (8 mils)
    • BGA pitch: 0.2mm (8 mils)
  • Solder mask:
    • Minimum solder mask dam: 0.0635mm (2.5 mils)
    • Solder mask clearance: 0.1mm (4 mils)
    • Minimum SMT pad spacing: 0.1mm (4 mils)
    • Solder mask thickness: 0.0007 inch (0.018mm)
  • Minimum whole diameter: 0.4mm
  • Minimum line width: 0.3 mm
  • Minimum line spacing: 0.3 mm
  • Surface finish: lead-free HASL
  • Solder mask: green
  • With UL and RoHS marks
  • RoHS: A001C100827049001-2
  • SGS: CANEC1000312001
  • UL: E320045
  • Material: FR-4/Hi Tg FR-4/lead-free materials (RoHScompliant)/CEM-3, aluminum, metal based
  • Layer number: 1 to 16
  • Finished board thickness: 0.2 to 3.8mm (8 to 150 mils)
  • Board thickness tolerance: ±10%
  • Cooper thickness: 0.5 to 6oz (18 to 210um)
  • Copper plating hole: 18 to 40um
  • Impedance control: ±10%
  • Warp and twist: 0.70%
  • Peel able: 0.012 (0.3mm) to 0.02 inch (0.5mm)
  • Minimum trace width: 0.1mm (4 mils)
  • Minimum space width: 0.1mm (4 mils)
  • Minimum annular ring: 0.1mm (4 mils)
  • SMD pitch: 0.2mm (8 mils)
  • BGA pitch: 0.2mm (8 mils)
  • Minimum solder mask dam: 0.0635mm (2.5 mils)
  • Solder mask clearance: 0.1mm (4 mils)
  • Minimum SMT pad spacing: 0.1mm (4 mils)
  • Solder mask thickness: 0.0007 inch (0.018mm)

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