Shenzhen Hongmy Precision Circuit Co. Ltd
Shenzhen Hongmy Precision Circuit Co. Ltd
Double-sided PCB with HAL Surface Finish and 1.0mm Board Thickness
  • Double-sided PCB with HAL Surface Finish and 1.0mm Board Thickness
Double-sided PCB with HAL Surface Finish and 1.0mm Board Thickness

Double-sided PCB with HAL Surface Finish and 1.0mm Board Thickness

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Basic Info
Basic Info
Payment Type: T/T, L/C, Western Union, PayPal
Product Description
Product Description
  • Specifications:
    • Layers: 2
    • Board material: FR-4
    • Board thickness: 1.0mm
    • Finish copper thickness: 1oz
    • Minimum drilling diameter: 0.3mm
    • Minimum line width: 0.2mm
    • Surface finish: HAL (lead-free)
    • Manufacture capability
    • Item manufacture capability
    • Layers: 1 to 16 layers
    • Material: FR-4, aluminum base, rogers and taconic
    • Finish board thicknesses: 0.2 to 3.2mm (8 to126mil)
    • External copper thicknesses: 35 to 210um
    • Internal copper thicknesses: 17 to 140um
    • Copper plating holes: 18 to 40um
    • Minimum trace width and line spacing: 0.075/0.1mm (3/4mil)
    • Minimum hole dimensions (CNC): 0.20mm (8mil)
    • Minimum hole dimensions (punching): 0.9mm (35mil)
    • Maximum panel dimensions: 610 x 508mm
    • Hole position tolerance (CNC): ±0.075mm
    • Hole dimension tolerance (CNC): PTH: ±0.075mm, NPTH: ±0.05mm
    • Outline tolerance CNC: ±0.125mm, punching: ±0.15mm
    • Warp and twist: 0.70%
    • Minimum solder mask bridge: 0.0635mm
    • Distance between line to board edge outline: 0.25mm, v-cut: 0.40mm
    • Impedance control tolerance: ±10%
    • Test voltages: 10 to 300V
    • Solder mask types: green, yellow, red, white, blue, matt green, matt black and more
    • Surface finishing: HASL, immersion silver/gold, plate gold and gold finger
  • Layers: 2
  • Board material: FR-4
  • Board thickness: 1.0mm
  • Finish copper thickness: 1oz
  • Minimum drilling diameter: 0.3mm
  • Minimum line width: 0.2mm
  • Surface finish: HAL (lead-free)
  • Manufacture capability
  • Item manufacture capability
  • Layers: 1 to 16 layers
  • Material: FR-4, aluminum base, rogers and taconic
  • Finish board thicknesses: 0.2 to 3.2mm (8 to126mil)
  • External copper thicknesses: 35 to 210um
  • Internal copper thicknesses: 17 to 140um
  • Copper plating holes: 18 to 40um
  • Minimum trace width and line spacing: 0.075/0.1mm (3/4mil)
  • Minimum hole dimensions (CNC): 0.20mm (8mil)
  • Minimum hole dimensions (punching): 0.9mm (35mil)
  • Maximum panel dimensions: 610 x 508mm
  • Hole position tolerance (CNC): ±0.075mm
  • Hole dimension tolerance (CNC): PTH: ±0.075mm, NPTH: ±0.05mm
  • Outline tolerance CNC: ±0.125mm, punching: ±0.15mm
  • Warp and twist: 0.70%
  • Minimum solder mask bridge: 0.0635mm
  • Distance between line to board edge outline: 0.25mm, v-cut: 0.40mm
  • Impedance control tolerance: ±10%
  • Test voltages: 10 to 300V
  • Solder mask types: green, yellow, red, white, blue, matt green, matt black and more
  • Surface finishing: HASL, immersion silver/gold, plate gold and gold finger
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