Shenzhen Hongmy Precision Circuit Co. Ltd
Products
Products
Shenzhen Hongmy Precision Circuit Co. Ltd
Aluminum Base PCB with HASL Surface Finish and Black Solder Mask
  • Aluminum Base PCB with HASL Surface Finish and Black Solder Mask
Aluminum Base PCB with HASL Surface Finish and Black Solder Mask

Aluminum Base PCB with HASL Surface Finish and Black Solder Mask

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Basic Info
Basic Info
Payment Type: T/T, L/C, Western Union, PayPal
Product Description
Product Description
  • Features:
    • Applicable for high-power PCB
    • Material: aluminum 5052
    • Thermal conductivity: 2.0
    • Finish thickness: 1.0 ±7%mm
    • Surface finishing: lead-free HASL
    • Aluminum base thickness: 1.0mm
    • Dielectric thickness: 80 ±20μm
  • Our product range:
    • We offer a wide range of PCBs such as single-sided, double-sided, multi-layer, high-frequency, MCPCB, metal-backed PCB and more
    • Product quality:
      • Our factories got UL certificates and our products meet RoHS standards
      • RoHS: A001C100827049001-2
      • SGS: CANEC1000312001
      • UL: E320045If our PCBs can meet your requirements, welcome to receive your inquiry or trial order for testing our price and quality
      • We will quote to you the best price for your reference as soon as we receive your specific inquiry
  • Specifications:
    • Item manufacture capability
    • Materials: FR-4/Hi Tg FR-4/lead-free materials (RoHS compliant)/
    • CEM-3, aluminum, metal based
    • Layers number: 1 to 16
    • Finished board thickness: 0.2 to 3.8mm (8 to 150-mil)
    • Board thickness tolerance: ±10%
    • Cooper thickness: 0.5 to 6oz (18 to 210um)
    • Copper plating hole: 18 to 40um Impedance control: ±10%
    • Warp/twist: 0.70%
    • Peel able: 0.012 to 0.02 (0.3 to 0.5mm)
    • Images:
      • Solder mask:
        • Minimum trace width (a): 0.075mm (3-mil)
        • Minimum space width (b): 0.1mm (4-mil)
        • Minimum annular ring: 0.1mm (4-mil)
        • SMD pitch (a): 0.2mm (8-mil) BGA pitch (b): 0.2mm (8-mil), 0.05mm
        • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
        • Solder mask clearance (b): 0.1mm (4-mil)
        • Minimum SMT pad spacing (c): 0.1mm (4-mil)
        • Solder mask thickness: 0.0007-inch (0.018mm)
  • Applicable for high-power PCB
  • Material: aluminum 5052
  • Thermal conductivity: 2.0
  • Finish thickness: 1.0 ±7%mm
  • Surface finishing: lead-free HASL
  • Aluminum base thickness: 1.0mm
  • Dielectric thickness: 80 ±20μm
  • We offer a wide range of PCBs such as single-sided, double-sided, multi-layer, high-frequency, MCPCB, metal-backed PCB and more
  • Product quality:
    • Our factories got UL certificates and our products meet RoHS standards
    • RoHS: A001C100827049001-2
    • SGS: CANEC1000312001
    • UL: E320045If our PCBs can meet your requirements, welcome to receive your inquiry or trial order for testing our price and quality
    • We will quote to you the best price for your reference as soon as we receive your specific inquiry
  • Our factories got UL certificates and our products meet RoHS standards
  • RoHS: A001C100827049001-2
  • SGS: CANEC1000312001
  • UL: E320045If our PCBs can meet your requirements, welcome to receive your inquiry or trial order for testing our price and quality
  • We will quote to you the best price for your reference as soon as we receive your specific inquiry
  • Item manufacture capability
  • Materials: FR-4/Hi Tg FR-4/lead-free materials (RoHS compliant)/
  • CEM-3, aluminum, metal based
  • Layers number: 1 to 16
  • Finished board thickness: 0.2 to 3.8mm (8 to 150-mil)
  • Board thickness tolerance: ±10%
  • Cooper thickness: 0.5 to 6oz (18 to 210um)
  • Copper plating hole: 18 to 40um Impedance control: ±10%
  • Warp/twist: 0.70%
  • Peel able: 0.012 to 0.02 (0.3 to 0.5mm)
  • Images:
    • Solder mask:
      • Minimum trace width (a): 0.075mm (3-mil)
      • Minimum space width (b): 0.1mm (4-mil)
      • Minimum annular ring: 0.1mm (4-mil)
      • SMD pitch (a): 0.2mm (8-mil) BGA pitch (b): 0.2mm (8-mil), 0.05mm
      • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
      • Solder mask clearance (b): 0.1mm (4-mil)
      • Minimum SMT pad spacing (c): 0.1mm (4-mil)
      • Solder mask thickness: 0.0007-inch (0.018mm)
  • Solder mask:
    • Minimum trace width (a): 0.075mm (3-mil)
    • Minimum space width (b): 0.1mm (4-mil)
    • Minimum annular ring: 0.1mm (4-mil)
    • SMD pitch (a): 0.2mm (8-mil) BGA pitch (b): 0.2mm (8-mil), 0.05mm
    • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
    • Solder mask clearance (b): 0.1mm (4-mil)
    • Minimum SMT pad spacing (c): 0.1mm (4-mil)
    • Solder mask thickness: 0.0007-inch (0.018mm)
  • Minimum trace width (a): 0.075mm (3-mil)
  • Minimum space width (b): 0.1mm (4-mil)
  • Minimum annular ring: 0.1mm (4-mil)
  • SMD pitch (a): 0.2mm (8-mil) BGA pitch (b): 0.2mm (8-mil), 0.05mm
  • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
  • Solder mask clearance (b): 0.1mm (4-mil)
  • Minimum SMT pad spacing (c): 0.1mm (4-mil)
  • Solder mask thickness: 0.0007-inch (0.018mm)

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