Shenzhen Leadsin Technology Co. Ltd
Products
Products
Shenzhen Leadsin Technology Co. Ltd
Printed Circuit Assembly, OEM/ODM Services are Provided, Made of FR-4 Material
  • Printed Circuit Assembly, OEM/ODM Services are Provided, Made of FR-4 Material
Printed Circuit Assembly, OEM/ODM Services are Provided, Made of FR-4 Material

Printed Circuit Assembly, OEM/ODM Services are Provided, Made of FR-4 Material

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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Specifications:
    • Maximum panel size: 19.7 x 31.5 inches
    • Maximum number of layers: 1 to 30
    • Copper thicknesses: 0.5 to 5.0oz
    • Minimum line width: 3 mils
    • Minimum line spacing: 3 mils
    • Smallest hole: 0.006 inches
    • Blind, buried and plugged vias
    • Controlled impedance
    • Solder mask (LPI): green, yellow, black, red, blue and more
    • Peelable mask
    • Inspection methods
    • 100% visual inspection
    • Electrical testing, flying probe or nails bed
    • Sample lot inspection
    • Cross sectioning
    • SMOBC (HASL)
    • Carbon
    • Selective gold plating
    • Hard and soft gold
    • Immersion gold
    • Immersion silver
    • Immersion tin
    • OSP

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