Rigid-flexible Circuit Boards Layout, Customized Specifications are Welcome

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Basic Info

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Product Description

Layer: 1 to 22

Materials: FR-1, FR-2, FR-4, CEM-1, CEM-3, High TG and FR4 halogen-free

Board thickness: 0.2 to 3.5mm

Maximum panel size: 630 x 520mm

Minimum drilled hole size: 0.5mm

Minimum line width: 0.075mm (3mil)

Minimum line spacing: 0.075mm (3mil)

Surface finish/treatment: HASL/HASL lead-free, chemical tin, chemical gold, immersion gold, immersion silver, gold, OSP and gold plating

Copper thickness: 0.5oz minimum and 5.0oz maximum

Soldering mask colors: green/black/white/red/blue/yellow

Electronic components: high-precision 0201, 0402, 0603, fine pitch QFP, BGA

Inner packing: vacuum and plastic bag

Outer packing: standard carton

Hole tolerance:

PTH: ±0.076

NTPH: ±0.05

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