PCB Assemblies with Minimum Line Spacing/Width/Hole and 1 to 22 Layers

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Basic Info

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Product Description

Specifications:

Layers: 1 to 22
Product type: rigid PCB, high density inverter PCB, thickcopper PCB
Materials: FR-4, CEM-3, Teflon, aluminum substrate, Rogers,halogen free and high Tg
Copper thickness: 140 micron (4oz)
Board thickness: 0.4mm (minimum)
Board thickness: 5.0mm (maximum)
Finished hole diameter: 0.1mm (minimum)
Outer layer line width/spacing: 0.1/0.1mm
Inner layer line width/spacing: 0.1/0.1mm
Aperture: 0.2mm (minimum)
Laser drilling: 0.1mm (minimum)
Ring width: 0.11mm (minimum)
BGA-bit hole spacing: 0.4mm (minimum)
Resistance tolerance: ±10%
Insulation thickness: 3 mils (minimum)
Laser blind hole thickness to diameter ratio: 0.8:1(maximum)
Working board size: 520 x 622mm (maximum)
Drilling tolerance (PTH): ±0.075mm
Drilling tolerance (NPTH): ±0.05mm
Outline tolerance (CNC): ±0.13mm