High-flammability Class Air Condition Electronic Component Assembly, 2 to 22 Layers

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Basic Info

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Product Description

Layer: 2 to 22

Product type: rigid PCB, high-density inverter PCB, thick copper PCB

Materials: FR-4, CEM-3, Teflon, aluminum substrate, Rogers, halogen-free and high-Tg

Copper thickness: 140 micron (4oz)

Board thickness: 0.4mm (minimum)

Board thickness: 5.0mm (maximum)

Finished hole diameter: 0.1mm (minimum)

Outer layer line width/spacing: 0.1/0.1mm

Inner layer line width/spacing: 0.1/0.1mm

Aperture: 0.2mm (minimum)

Laser drilling: 0.1mm (minimum)

Ring width: 0.11mm (minimum)

BGA-bit hole spacing: 0.4mm (minimum)

Resistance tolerance: ±10%

Insulation thickness: 3 mils (minimum)

Laser blind hole thickness to diameter ratio: 0.8:1(maximum)

Working board size: 520 x 622mm (maximum)

Drilling tolerance (PTH): ±0.075mm

Drilling tolerance (NPTH): ±0.05mm

Outline tolerance (CNC): ±0.13mm

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