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Basic Info

Payment Type:	T/T in Advance, L/C or PayPal

Product Description

Leadsintec specializes in producing the various electronic products based on your customized designs

The product field includes but are not limited to:

Notebook PC
Telecom audio and video
Electronic security health and medical
LED application test instrument
Consumer electronics
Enabling you to focus on product development and sales, we can solve your production technology issues and take care of product quality
The operation we can handle for you is from the Bare PC board fabrication, full component procurement, SMT/BGA/DIP assembly, mechanical/case assembly, rubber molding, functional testing, repair, inspection of finished goods to shipment arrangement

Our assembly competence:

Stencil size/range: 736 x 736mm
Minimum IC pitch: 0.30mm
Maximum PCB size: 410 x 360mm
Minimum PCB thickness: 0.35mm
Minimum chip size: 0201 (0.2 x 0.1)/0603 (0.6 x 0.3mm)
Maximum BGA size: 74 x 74mm
BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum)
BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum)
QFP lead pitch: 0.38mm (minimum), 2.54mm (maximum)
Frequency of stencil cleaning: 1 time/5 to 10 pieces
E-mail us to find out how we can fill your requirements
We sincerely hope we can become your supplier in Far East

Notebook PC

Telecom audio and video

Electronic security health and medical

LED application test instrument

Consumer electronics

Enabling you to focus on product development and sales, we can solve your production technology issues and take care of product quality

The operation we can handle for you is from the Bare PC board fabrication, full component procurement, SMT/BGA/DIP assembly, mechanical/case assembly, rubber molding, functional testing, repair, inspection of finished goods to shipment arrangement

Stencil size/range: 736 x 736mm

Minimum IC pitch: 0.30mm

Maximum PCB size: 410 x 360mm

Minimum PCB thickness: 0.35mm

Minimum chip size: 0201 (0.2 x 0.1)/0603 (0.6 x 0.3mm)

Maximum BGA size: 74 x 74mm

BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum)

BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum)

QFP lead pitch: 0.38mm (minimum), 2.54mm (maximum)

Frequency of stencil cleaning: 1 time/5 to 10 pieces

E-mail us to find out how we can fill your requirements

We sincerely hope we can become your supplier in Far East