Shenzhen Leadsin Technology Co. Ltd
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Products
Shenzhen Leadsin Technology Co. Ltd
Shenzhen Electronics PCB Assembly with 2 to 18 Layers
  • Shenzhen Electronics PCB Assembly with 2 to 18 Layers
Shenzhen Electronics PCB Assembly with 2 to 18 Layers

Shenzhen Electronics PCB Assembly with 2 to 18 Layers

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Basic Info
Basic Info
Payment Type: T/T in advance, L/C or Paypal
Product Description
Product Description
  • PCB board processing capability:
    • Layers: single sided, 2 to 18 layers
    • Board material types: FR4, CEM-1, CEM-3, ceramic substrate board, aluminum based board, high-Tg, Rogers and more
    • Compound material lamination: 4 to 6 layers
    • Maximum dimension 610 x 1,100mm
    • Dimension tolerance ±0.13mm
    • Board thickness coverage 0.2 to 6.00mm
    • Board thickness tolerance ±10%
    • DK thickness 0.076 to 6.00mm
    • Minimum line width 0.10mm
    • Minimum line space 0.10mm
    • Outer layer copper thickness 8.75 to 175µm
    • Inner layer copper thickness 17.5 to 175µm
    • Drilling hole diameter (mechanical drill): 0.25 to 6.00mm
    • Finished hole diameter (mechanical drill): 0.20 to 6.00mm
    • Hole diameter tolerance (mechanical drill): 0.05mm
    • Hole position tolerance (mechanical drill): 0.075mm
    • Laser drill hole size: 0.10mm
    • Board thickness and hole diameter ratio: 10:1
    • Solder mask type Green, Yellow, Black, Purple, Blue, White and Red
    • Minimum solder mask Ø0.10mm
    • Minimum size of solder mask separation ring 0.05mm
    • Solder mask oil plug hole diameter 0.25 to 0.60mm
    • Impedance control tolerance ±10%
    • Surface finish Hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger
  • Shenzhen electronics PCB assembly:
    • PCB and PCBA contract manufacturing
    • Reverse engineering services
    • PCB design and assembly
    • Component procurement and material management
    • Product design
    • Fast PCB and PCBA prototyping
    • Cable and wire assemblies
    • Plastics and molds
    • AOI, X-ray testing, other function testing service
  • All of the above description is to demonstrate the ability of our factory, if you have specific requirements, please contact us
  • Layers: single sided, 2 to 18 layers
  • Board material types: FR4, CEM-1, CEM-3, ceramic substrate board, aluminum based board, high-Tg, Rogers and more
  • Compound material lamination: 4 to 6 layers
  • Maximum dimension 610 x 1,100mm
  • Dimension tolerance ±0.13mm
  • Board thickness coverage 0.2 to 6.00mm
  • Board thickness tolerance ±10%
  • DK thickness 0.076 to 6.00mm
  • Minimum line width 0.10mm
  • Minimum line space 0.10mm
  • Outer layer copper thickness 8.75 to 175µm
  • Inner layer copper thickness 17.5 to 175µm
  • Drilling hole diameter (mechanical drill): 0.25 to 6.00mm
  • Finished hole diameter (mechanical drill): 0.20 to 6.00mm
  • Hole diameter tolerance (mechanical drill): 0.05mm
  • Hole position tolerance (mechanical drill): 0.075mm
  • Laser drill hole size: 0.10mm
  • Board thickness and hole diameter ratio: 10:1
  • Solder mask type Green, Yellow, Black, Purple, Blue, White and Red
  • Minimum solder mask Ø0.10mm
  • Minimum size of solder mask separation ring 0.05mm
  • Solder mask oil plug hole diameter 0.25 to 0.60mm
  • Impedance control tolerance ±10%
  • Surface finish Hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger
  • PCB and PCBA contract manufacturing
  • Reverse engineering services
  • PCB design and assembly
  • Component procurement and material management
  • Product design
  • Fast PCB and PCBA prototyping
  • Cable and wire assemblies
  • Plastics and molds
  • AOI, X-ray testing, other function testing service

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