Shenzhen Leadsin Technology Co. Ltd
Shenzhen Leadsin Technology Co. Ltd
PCB Board with Assembly BGA, from Leadsintec Manufacturer
  • PCB Board with Assembly BGA, from Leadsintec Manufacturer
PCB Board with Assembly BGA, from Leadsintec Manufacturer

PCB Board with Assembly BGA, from Leadsintec Manufacturer

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Basic Info
Basic Info
Payment Type: T/T in Advance, L/C or PayPal
Product Description
Product Description
  • Electronic board service
  • Lots of colors of LED light
  • No minimum order quantity
  • CE, ISO 9001:2000 and other approvals
  • Item parameters:
    • Double-sided, multilayer
    • Number of layers: 2 1-22
    • Copper thickness: 0.25-3.0, 0.5-3.0oz
    • Base board thickness: 0.3-3.2mm, 0.6-7.0mm
    • Incombustibility: 94V-0, 94V-0
    • Peelable resistance: 12.3N/cm, 12.3N/cm
    • Twist: ≤0.5%
    • Insulation resistance: ≥1,011Ω, ≥1,011Ω
    • Test voltage: 10-300V, 10-300V
    • Finished board area: 560×970mm, 560×970mm
    • Minimum line width and spacing: 0.1/0.1mm, 0.1/0.1mm
    • Copper thickness in hole: ≥25.0um, ≥25.0um
    • Minimum pad diameter Inner layer: 0.05mm
    • Outer layer: 0.076mm, 0.076mm
    • Minimum hole diameter: 0.25mm, 0.20mm
    • Hole tolerance:
      • PTH: ±0.076mm, ±0.076mm
      • NPTH: ±0.05mm, ±0.05mm
    • Hole location tolerance: ±0.076mm,l ±0.05mm
    • Profile tolerance routing: ±0.1mm, ±0.1mm
    • Punching: ±0.13mm, ±0.13mm
    • Solder mask bridge ability: ≥0.1mm, ≥0.075mm
    • Solder mask rigidity: 6H
    • Solderable test: 245 ºC/5 seconds, 245ºC/5 seconds
    • Thermal cycling ability: 288ºC/10 seconds, 288ºC/10 seconds
    • Surface finishing: OSP, HAL, Immersion gold, gold plating, rosin, gold finger OSP, HAL, Immersion gold, gold
  • Double-sided, multilayer
  • Number of layers: 2 1-22
  • Copper thickness: 0.25-3.0, 0.5-3.0oz
  • Base board thickness: 0.3-3.2mm, 0.6-7.0mm
  • Incombustibility: 94V-0, 94V-0
  • Peelable resistance: 12.3N/cm, 12.3N/cm
  • Twist: ≤0.5%
  • Insulation resistance: ≥1,011Ω, ≥1,011Ω
  • Test voltage: 10-300V, 10-300V
  • Finished board area: 560×970mm, 560×970mm
  • Minimum line width and spacing: 0.1/0.1mm, 0.1/0.1mm
  • Copper thickness in hole: ≥25.0um, ≥25.0um
  • Minimum pad diameter Inner layer: 0.05mm
  • Outer layer: 0.076mm, 0.076mm
  • Minimum hole diameter: 0.25mm, 0.20mm
  • Hole tolerance:
    • PTH: ±0.076mm, ±0.076mm
    • NPTH: ±0.05mm, ±0.05mm
  • Hole location tolerance: ±0.076mm,l ±0.05mm
  • Profile tolerance routing: ±0.1mm, ±0.1mm
  • Punching: ±0.13mm, ±0.13mm
  • Solder mask bridge ability: ≥0.1mm, ≥0.075mm
  • Solder mask rigidity: 6H
  • Solderable test: 245 ºC/5 seconds, 245ºC/5 seconds
  • Thermal cycling ability: 288ºC/10 seconds, 288ºC/10 seconds
  • Surface finishing: OSP, HAL, Immersion gold, gold plating, rosin, gold finger OSP, HAL, Immersion gold, gold
  • PTH: ±0.076mm, ±0.076mm
  • NPTH: ±0.05mm, ±0.05mm
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