
Medical PCB assembly
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Product Description
Product Description
- Material: aluminum
- Board thickness: 1.0mm
- Copper thickness: 0.5oz
- Surface treatment: HASL lead-free
- Solder mask: black
- Silkscreen: white
- 112 pieces highlight LEDs from original Kingbright brand
- Products experience range: traffic lights, infrared LED for car, streetlights, flashlight, and billboards
- Indoor/outdoor LED display and more
- Hoaxing can offer one-stop service from schematic design, board layout, component selection, firmware design, and mechanical design to PCBA and chip cloning
- Materials: FR-4 (standard FR4, Mid-Tg FR4, Hi-Tg FR4, lead-free assembly material), halogen-free, ceramic filled, Teflon, polyimide, BT, PPO, PPE, hybrid, partial hybrid and more
- Layers:
- Mass production: 2 to 20 layers
- Pilot run: 30 layers
- Maximum thickness:
- Mass production: 394 mils (10mm)
- Pilot run: 17.5mm
- Minimum width/space:
- Inner layer: 3/3 mils (Hoz)
- Outer layer: 4/4 mils (1oz)
- Minimum hole size:
- Mechanical drill: 8 mils (0.2mm)
- Laser drill: 3 mils (0.075mm)
- Maximum panel size: 1,150 x 560mm
- Surface finishing: HASL, immersion gold, immersion tin, OSP, ENIG + OSP, immersion silver, ENEPIG and gold finger
- Special process: buried hole, blind hole, embedded resistance, embedded capacity, hybrid, partial hybrid, partial high-density, back drilling
- SMT:
- Position accuracy: 20um
- Components size: 0.4 x 0.2mm (01005), —130 x 79mm, flip-chip, QFP, BGA and POP
- Maximum component height: 25mm
- Maximum PCB size: 680 x 500mm
- PCB thickness: 0.3 to 6mm
- PCB weight: 3kg
- Wave-solder:
- Maximum PCB width: 450mm
- Component height: top 120mm/bottom 15mm
- Sweat-solder:
- Metal type: part, whole, inlay and sidestep
- Metal material: copper and aluminum
- Surface finishing: plating aluminum, plating sliver, plating SN
- Air blade rate: less than 20%
- Testing: ICT, probe flying, burn-in, function test, temperature cycling
- Mass production: 2 to 20 layers
- Pilot run: 30 layers
- Mass production: 394 mils (10mm)
- Pilot run: 17.5mm
- Inner layer: 3/3 mils (Hoz)
- Outer layer: 4/4 mils (1oz)
- Mechanical drill: 8 mils (0.2mm)
- Laser drill: 3 mils (0.075mm)
- Maximum panel size: 1,150 x 560mm
- Position accuracy: 20um
- Components size: 0.4 x 0.2mm (01005), —130 x 79mm, flip-chip, QFP, BGA and POP
- Maximum component height: 25mm
- Maximum PCB size: 680 x 500mm
- PCB thickness: 0.3 to 6mm
- PCB weight: 3kg
- Maximum PCB width: 450mm
- Component height: top 120mm/bottom 15mm
- Metal type: part, whole, inlay and sidestep
- Metal material: copper and aluminum
- Surface finishing: plating aluminum, plating sliver, plating SN
- Air blade rate: less than 20%
- Testing: ICT, probe flying, burn-in, function test, temperature cycling
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