PCBA, Shenzhen with FR4 Material, 1.6mm and 3oz Cooper Thickness, OEM Services Provided

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Payment Type:	Paypal

Product Description

We are capable of providing cost effective and high-quality vertical manufacturing services from PCB assembly to final case assembly:

Chip-on-board (COB)
Surface-mount technology (SMT)
Ball-grid array (BGA)
Through-hole

Primary competitive advantages:

Profound knowledge of contract manufacturing services
Capable of developing effective production process to ensure high-quality and consistency
Experienced logistics management
Cost-effective factory located in mainland China
Able to handle small as well as large volume production with flexibility
We quote the price for customers within 3 days
Our building products experience range: industrial, automotive, computing, storage, consumer, instrumentation, medical, networking, peripherals and telecommunications

Chip-on-board (COB)

Surface-mount technology (SMT)

Ball-grid array (BGA)

Through-hole

Profound knowledge of contract manufacturing services

Capable of developing effective production process to ensure high-quality and consistency

Experienced logistics management

Cost-effective factory located in mainland China

Able to handle small as well as large volume production with flexibility

We quote the price for customers within 3 days

Our building products experience range: industrial, automotive, computing, storage, consumer, instrumentation, medical, networking, peripherals and telecommunications

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