Housing Electronic and PCBA Assembly with F4 Materials and 3 Mils Minimum Insulation Thickness

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Basic Info

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Product Description

Injection mod service and PCB assembly:

Layers: 2 to 22
Product type: rigid PCB, high-density inverter PCB, thick copper PCB
Materials: FR-4, CEM-3, Teflon, aluminum substrate, Rogers, halogen free, high-Tg
Copper thickness: 140 micron (4oz)
Minimum board thickness: 0.4mm
Maximum board thickness: 5.0mm
Minimum finished hole diameter: 0.1mm
Outer layer line width/spacing: 0.1/0.1mm
Inner layer line width/spacing: 0.1/0.1mm
Minimum aperture: 0.2mm
Minimum laser drilling: 0.1mm
Minimum ring width: 0.11mm
Minimum BGA-bit hole spacing: 0.4mm
Resistance tolerance: ± 10%
Minimum insulation thickness: 3 mils
Maximum laser blind hole thickness to diameter ratio: 0.8:1
Maximum working board size: 520 x 622mm
Drilling tolerance (PTH): ±0.075mm
Drilling tolerance (NPTH): ±0.05mm
Outline tolerance (CNC): ±0.13mm